Jivaan Kishore Jhothiraman

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including stair step structures, and relate...
- Patent number 12,063,778
- Issue date Aug 13, 2024
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 12,010,850
- Issue date Jun 11, 2024
- John D. Hopkins
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,978,705
- Issue date May 7, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks
- Patent number 11,744,072
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Microelectronic devices with a polysilicon structure adjacent a sta...
- Patent number 11,710,710
- Issue date Jul 25, 2023
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including stair step structures, and related mem...
- Patent number 11,688,689
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming integrated circuitry comprising a stack com...
- Patent number 11,647,633
- Issue date May 9, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including stair step structures, and relate...
- Patent number 11,411,013
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory arrays comprising strings of memory ce...
- Patent number 11,302,712
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Chandra Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies include stacked memory decks
- Patent number 11,107,831
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step structures including insulative materials, and related d...
- Patent number 11,088,017
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with polysilicon fill material between oppo...
- Patent number 11,088,088
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a stair step structure, and related...
- Patent number 10,600,682
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures having stair step struc...
- Patent number 10,269,625
- Issue date Apr 23, 2019
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STR...
- Publication number 20240407161
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES WHICH INCLUDE STACKED MEMORY DECKS, AND METHO...
- Publication number 20240397717
- Publication date Nov 28, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240250033
- Publication date Jul 25, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240071932
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS
- Publication number 20240071819
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20240008275
- Publication date Jan 4, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20230395494
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...
- Publication number 20230378069
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20230361053
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20230255030
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20230178488
- Publication date Jun 8, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED MEM...
- Publication number 20220359391
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...
- Publication number 20220271051
- Publication date Aug 25, 2022
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20220013530
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...
- Publication number 20210358868
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210358951
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...
- Publication number 20210335803
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Chandra Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...
- Publication number 20210210499
- Publication date Jul 8, 2021
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210167081
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...
- Publication number 20210134736
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR STEP STRUCTURES INCLUDING INSULATIVE MATERIALS, AND RELATED D...
- Publication number 20200203220
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A STAIR STEP STRUCTURE, AND RELATED...
- Publication number 20190206727
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS

Jivaan Kishore Jhothiraman

Person

Patents Grantslast 30 patents

Electronic devices comprising a compressive dielectric material, an...

Microelectronic devices including stair step structures, and relate...

Integrated assemblies which include stacked memory decks, and metho...

Methods of forming microelectronic devices, and related microelectr...

Integrated assemblies which include stacked memory decks

Microelectronic devices with a polysilicon structure adjacent a sta...

Electronic devices including stair step structures, and related mem...

Methods used in forming integrated circuitry comprising a stack com...

Microelectronic devices including stair step structures, and relate...

Integrated circuitry, memory arrays comprising strings of memory ce...

Methods of forming integrated assemblies include stacked memory decks

Stair step structures including insulative materials, and related d...

Microelectronic devices with polysilicon fill material between oppo...

Semiconductor devices including a stair step structure, and related...

Methods of forming semiconductor structures having stair step struc...

Patents Applicationslast 30 patents

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING STAIR STEP STR...

INTEGRATED ASSEMBLIES WHICH INCLUDE STACKED MEMORY DECKS, AND METHO...

METHODS OF FORMING MICROELECTRONIC DEVICES

Memory Circuitry And Method Used In Forming Memory Circuitry

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

STRESS MITIGATION FOR THREE-DIMENSIONAL METAL CONTACTS

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Memory Circuitry And Method Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

ELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED MEM...

MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Ce...

MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...

STAIR STEP STRUCTURES INCLUDING INSULATIVE MATERIALS, AND RELATED D...

SEMICONDUCTOR DEVICES INCLUDING A STAIR STEP STRUCTURE, AND RELATED...