Jiwei Sun

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect loss of high density package with magnetic material
- Patent number 12,009,320
- Issue date Jun 11, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,715,889
- Issue date Aug 1, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,664,596
- Issue date May 30, 2023
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,121,468
- Issue date Sep 14, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,095,045
- Issue date Aug 17, 2021
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 10,797,394
- Issue date Oct 6, 2020
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240105577
- Publication date Mar 28, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS
- Publication number 20240006323
- Publication date Jan 4, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT
- Publication number 20240006289
- Publication date Jan 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PATHWAY ROUTING VIA THROUGH HOLE
- Publication number 20230420298
- Publication date Dec 28, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT
- Publication number 20230317588
- Publication date Oct 5, 2023
- Intel Corporation
- Jiwei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING SIGNAL SHIELDING FOR USE WITH SEMICONDUCTOR...
- Publication number 20230103183
- Publication date Mar 30, 2023
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS
- Publication number 20230088928
- Publication date Mar 23, 2023
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
- Publication number 20220037803
- Publication date Feb 3, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20210344116
- Publication date Nov 4, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LOSS OF HIGH DENSITY PACKAGE WITH MAGNETIC MATERIAL
- Publication number 20210104476
- Publication date Apr 8, 2021
- Intel Corporation
- Zhiguo QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20200403316
- Publication date Dec 24, 2020
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
- Publication number 20200014122
- Publication date Jan 9, 2020
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20190372229
- Publication date Dec 5, 2019
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20190355654
- Publication date Nov 21, 2019
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Interconnect loss of high density package with magnetic material

Slow wave structure for millimeter wave antennas

Antenna modules and communication devices

Thermal management solutions for integrated circuit packages

Microelectronic assemblies having conductive structures with differ...

Antenna modules and communication devices

Slow wave structure for millimeter wave antennas

Antenna modules and communication devices

Patents Applicationslast 30 patents

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS

LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT

MULTI-PATHWAY ROUTING VIA THROUGH HOLE

STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT

GLASS SUBSTRATES HAVING SIGNAL SHIELDING FOR USE WITH SEMICONDUCTOR...

EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS

ANTENNA MODULES AND COMMUNICATION DEVICES

INTERCONNECT LOSS OF HIGH DENSITY PACKAGE WITH MAGNETIC MATERIAL

ANTENNA MODULES AND COMMUNICATION DEVICES

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS

ANTENNA MODULES AND COMMUNICATION DEVICES

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...