Jiwen Wang

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Wilmington, DE, US

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Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide body with localized diamond reinforcement
- Patent number 11,584,694
- Issue date Feb 21, 2023
- II-VI DELAWARE, INC.
- Jon Coppola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REACTION-BONDED SILICON-CARBIDE WITH IN-SITU FORMED SILICON LAYER F...
- Publication number 20230373871
- Publication date Nov 23, 2023
- II-VI Delaware, Inc.
- Jiwen Wang
- B24 - GRINDING POLISHING
Information Patent Application
SILICON CARBIDE BODY WITH LOCALIZED DIAMOND REINFORCEMENT
- Publication number 20230150885
- Publication date May 18, 2023
- II-VI Delaware, Inc.
- Jon COPPOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE BODY WITH LOCALIZED DIAMOND REINFORCEMENT
- Publication number 20220227676
- Publication date Jul 21, 2022
- ll-VI Delaware, Inc
- Jon Coppola
- H01 - BASIC ELECTRIC ELEMENTS