Jiyong PARK

Person

Gyenggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus for isolating signal generation device
- Patent number 9,350,072
- Issue date May 24, 2016
- Samsung Electronics Co., Ltd.
- Jiyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip having side pad, method of fabricating the same and package us...
- Patent number 7,791,173
- Issue date Sep 7, 2010
- Samsung Electronics Co., Ltd.
- Jiyong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234279
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153855
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136266
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240063181
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240063106
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230361051
- Publication date Nov 9, 2023
- SAMSUNG ELECTRONICS CO,. LTD.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230361018
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A PLURALITY OF BATTERIES AND METHOD FO...
- Publication number 20230179003
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Gusup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...
- Publication number 20230110126
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JEONGHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220359439
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Eunsu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS FOR ISOLATING SIGNAL GENERATION DEVICE
- Publication number 20130120201
- Publication date May 16, 2013
- Samsung Electronics Co. Ltd.
- Jiyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HAVING SIDE PAD, METHOD OF FABRICATING THE SAME AND PACKAGE US...
- Publication number 20080174023
- Publication date Jul 24, 2008
- Samsung Electronics Co., Ltd.
- Jiyong PARK
- H01 - BASIC ELECTRIC ELEMENTS

Jiyong PARK

Person

Patents Grantslast 30 patents

Electronic apparatus for isolating signal generation device

Chip having side pad, method of fabricating the same and package us...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE COMPRISING A PLURALITY OF BATTERIES AND METHOD FO...

SEMICONDUCTOR PACKAGES HAVING A PACKAGE SUBSTRATE AND METHOD FOR MA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC APPARATUS FOR ISOLATING SIGNAL GENERATION DEVICE

CHIP HAVING SIDE PAD, METHOD OF FABRICATING THE SAME AND PACKAGE US...