Jo Ean Joanna Chye

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames including lead posts in different planes
- Patent number 11,011,456
- Issue date May 18, 2021
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH DUAL INTEGRATED HEAT SPREADERS
- Publication number 20220157686
- Publication date May 19, 2022
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Expanded Heat Spreader
- Publication number 20210166988
- Publication date Jun 3, 2021
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES
- Publication number 20210005541
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS