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Patents Grants
last 30 patents
Information
Patent Grant
Sensor package structure
Patent number
10,825,851
Issue date
Nov 3, 2020
KINGPAK TECHNOLOGY INC.
Sheng Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package structure
Patent number
10,720,370
Issue date
Jul 21, 2020
KINGPAK TECHNOLOGY INC.
Jian-Ru Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package structure
Patent number
10,600,830
Issue date
Mar 24, 2020
KINGPAK TECHNOLOGY INC.
Jian-Ru Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack type sensor package structure
Patent number
10,340,250
Issue date
Jul 2, 2019
KINGPAK TECHNOLOGY INC.
Jian-Ru Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor package structure
Patent number
9,905,597
Issue date
Feb 27, 2018
KINGPAK TECHNOLOGY INC.
Jo-Wei Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing tilt of optical unit during manufacture of imag...
Patent number
9,184,331
Issue date
Nov 10, 2015
Kingpak Technology Inc.
Chun-Hua Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Two-stage packaging method of image sensors
Patent number
8,969,120
Issue date
Mar 3, 2015
Kingpak Technology Inc.
Chun-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and manufacturing method for high resolution camera module
Patent number
8,703,519
Issue date
Apr 22, 2014
Kingpak Technology Inc.
Chun-Lung Huang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20210057470
Publication date
Feb 25, 2021
Kingpak Technology Inc.
LI-CHUN HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20200119070
Publication date
Apr 16, 2020
Kingpak Technology Inc.
SHENG YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20190355639
Publication date
Nov 21, 2019
Kingpak Technology Inc.
JIAN-RU CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK TYPE SENSOR PACKAGE STRUCTURE
Publication number
20190057952
Publication date
Feb 21, 2019
Kingpak Technology Inc.
Jian-Ru Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20190057992
Publication date
Feb 21, 2019
Kingpak Technology Inc.
JIAN-RU CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20180019274
Publication date
Jan 18, 2018
Kingpak Technology Inc.
JO-WEI YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-STAGE PACKAGING METHOD OF IMAGE SENSORS
Publication number
20150011038
Publication date
Jan 8, 2015
KINGPAK TECHNOLOGY INC.
Chun-Lung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA MODULE
Publication number
20140098287
Publication date
Apr 10, 2014
KINGPAK TECHNOLOGY INC.
Chun-Lung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...
Publication number
20130149805
Publication date
Jun 13, 2013
KINGPAK TECHNOLOGY INC.
Chun-Hua CHUANG
H01 - BASIC ELECTRIC ELEMENTS