Joachim Hirschler

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a silicon-insulator layer and semiconductor devi...
- Patent number 11,195,713
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices and semiconductor device
- Patent number 10,453,806
- Issue date Oct 22, 2019
- Infineon Teohnologies Austria AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin for substrate processing
- Patent number 10,195,704
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Christian Himmelsbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery electrode, battery, and method for manufacturing a battery...
- Patent number 10,170,746
- Issue date Jan 1, 2019
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 9,905,147
- Issue date Feb 27, 2018
- Infineon Technologies AG
- Joachim Hirschler
- G02 - OPTICS
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor device and chip package
- Patent number 9,614,045
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing a sacrificial material during manufacture of a microfabr...
- Patent number 9,511,560
- Issue date Dec 6, 2016
- Infineon Technologies AG
- Guenter Denifl
- B44 - DECORATIVE ARTS
Information Patent Grant
Kerf preparation for backside metallization
- Patent number 9,455,192
- Issue date Sep 27, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer arrangement
- Patent number 9,449,928
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 9,135,893
- Issue date Sep 15, 2015
- Infineon Technologies AG
- Joachim Hirschler
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 8,815,706
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a protection layer to protect a passivation while etching a...
- Patent number 8,748,307
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING POWER SEMICONDUC...
- Publication number 20230082571
- Publication date Mar 16, 2023
- INFINEON TECHNOLOGIES AG
- Jochen HILSENBECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...
- Publication number 20190385842
- Publication date Dec 19, 2019
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
- Publication number 20180145038
- Publication date May 24, 2018
- Infineon Technologies Austria AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embrittlement device, pick-up system and method of picking up chips
- Publication number 20160204017
- Publication date Jul 14, 2016
- Infineon Technologies Austria AG
- Michael Roesner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...
- Publication number 20160141208
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Hirschler Joachim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR DEVICE AND CHIP PACKAGE
- Publication number 20160079087
- Publication date Mar 17, 2016
- INFINEON TECHNOLOGIES AG
- SRINIVASA REDDY YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device
- Publication number 20150356907
- Publication date Dec 10, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Kerf Preparation for Backside Metallization
- Publication number 20150279740
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device
- Publication number 20140354714
- Publication date Dec 4, 2014
- Joachim Hirschler
- G02 - OPTICS
Information Patent Application
Carbon Layers for High Temperature Processes
- Publication number 20140335700
- Publication date Nov 13, 2014
- Guenter Denifl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Lift Pin for Substrate Processing
- Publication number 20140265098
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Christian Himmelsbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYER ARRANGEMENT
- Publication number 20140225233
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR STRUCTURE, AND A SEMICONDUCTOR ST...
- Publication number 20140145345
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES AG
- Helmut Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY ELECTRODE, BATTERY, AND METHOD FOR MANUFACTURING A BATTERY...
- Publication number 20140106229
- Publication date Apr 17, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER, AND LAYER ARRANGEMENT
- Publication number 20140061873
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING A SACRIFICIAL MATERIAL DURING MANUFACTURE OF A MICROFABR...
- Publication number 20130273326
- Publication date Oct 17, 2013
- INFINEON TECHNOLOGIES AG
- Guenther Denifl
- B44 - DECORATIVE ARTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20130189830
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS

Joachim Hirschler

Person

Patents Grantslast 30 patents

Semiconductor device including bonding pad metal layer structure

Methods of forming a silicon-insulator layer and semiconductor devi...

Methods for forming semiconductor devices and semiconductor device

Lift pin for substrate processing

Battery electrode, battery, and method for manufacturing a battery...

Display device

Method for processing a semiconductor substrate and a method for pr...

Method of processing a semiconductor device and chip package

Processing a sacrificial material during manufacture of a microfabr...

Kerf preparation for backside metallization

Layer arrangement

Display device

Methods of forming semiconductor devices

Use of a protection layer to protect a passivation while etching a...

Patents Applicationslast 30 patents

Semiconductor Device Including Bonding Pad Metal Layer Structure

POWER SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING POWER SEMICONDUC...

Semiconductor Device Including Bonding Pad Metal Layer Structure

Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...

METHODS FOR FORMING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

Embrittlement device, pick-up system and method of picking up chips

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...

METHOD OF PROCESSING A SEMICONDUCTOR DEVICE AND CHIP PACKAGE

Display Device

Kerf Preparation for Backside Metallization

Display Device

Carbon Layers for High Temperature Processes

Lift Pin for Substrate Processing

LAYER ARRANGEMENT

METHOD OF FORMING A SEMICONDUCTOR STRUCTURE, AND A SEMICONDUCTOR ST...

BATTERY ELECTRODE, BATTERY, AND METHOD FOR MANUFACTURING A BATTERY...

METHOD FOR PROCESSING A WAFER, AND LAYER ARRANGEMENT

PROCESSING A SACRIFICIAL MATERIAL DURING MANUFACTURE OF A MICROFABR...

Methods of Forming Semiconductor Devices