Joachim Mahler

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 11,296,015
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with cross-linked thermoplastic dielectric
- Patent number 10,854,547
- Issue date Dec 1, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,832,992
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor
- Patent number 10,670,474
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Christian Kegler
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a chip package with compounds to improve the dur...
- Patent number 10,672,678
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising a chemical compound and a method of forming...
- Patent number 10,497,634
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices and a method for forming a power semico...
- Patent number 10,497,694
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a heat sink structure
- Patent number 10,403,556
- Issue date Sep 3, 2019
- Infineon Technologies AG
- Johannes Georg Laven
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die attach system and method
- Patent number 10,297,564
- Issue date May 21, 2019
- Infineon Technologies AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Attaching chip attach medium to already encapsulated electronic chip
- Patent number 10,177,112
- Issue date Jan 8, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component and semiconductor...
- Patent number 10,121,690
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, a semiconductor diode and a method for formi...
- Patent number 10,038,105
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary mechanical stabilization of semiconductor cavities
- Patent number 9,988,262
- Issue date Jun 5, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a chip arrangement including a ceramic layer
- Patent number 9,984,897
- Issue date May 29, 2018
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards having a dielectric layer which includes a p...
- Patent number 9,986,636
- Issue date May 29, 2018
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 9,941,181
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding additive particles in encapsulant of electronic device
- Patent number 9,852,918
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Peh Hean Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor comprising negative temperature c...
- Patent number 9,825,023
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20210013132
- Publication date Jan 14, 2021
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing Electronic Devices
- Publication number 20200352034
- Publication date Nov 5, 2020
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING A CHIP PACKAGE
- Publication number 20190287875
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE
- Publication number 20190287907
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attach System and Method
- Publication number 20190109112
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining Materials, Electronic Devices and Methods for Manufacturing...
- Publication number 20180338379
- Publication date Nov 22, 2018
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Power Semiconductor Devices and a Method for Forming a Power Semico...
- Publication number 20180315744
- Publication date Nov 1, 2018
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES
- Publication number 20180086632
- Publication date Mar 29, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20180040530
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338165
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338164
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Attaching chip attach medium to already encapsulated electronic chip
- Publication number 20170221857
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards Having a Dielectric Layer Which Includes a P...
- Publication number 20170208684
- Publication date Jul 20, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Including a Heat Sink Structure
- Publication number 20170186663
- Publication date Jun 29, 2017
- INFINEON TECHNOLOGIES AG
- Johannes Georg Laven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR
- Publication number 20170082502
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Christian Kegler
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Devices, a Semiconductor Diode and a Method for Formi...
- Publication number 20170040431
- Publication date Feb 9, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20170004979
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20170003180
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MAN...
- Publication number 20160358886
- Publication date Dec 8, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Electrophoretically Depositing a Film on an Electronic A...
- Publication number 20160240449
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT
- Publication number 20160211226
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Joachim Mahler

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Semiconductor device with a heterogeneous solder joint and method f...

Die attach methods and semiconductor devices manufactured based on...

Circuit package, an electronic circuit package, and methods for enc...

Manufacturing a package using plateable encapsulant

Method of forming an electrical contact and method of forming a chi...

Chip package with cross-linked thermoplastic dielectric

Die attach methods and semiconductor devices manufactured based on...

Metallic interconnect, a method of manufacturing a metallic interco...

Temperature sensor

Method for forming a chip package with compounds to improve the dur...

Chip package comprising a chemical compound and a method of forming...

Power semiconductor devices and a method for forming a power semico...

Chip package and method of forming a chip package with a metal cont...

Semiconductor device including a heat sink structure

Semiconductor package with plateable encapsulant and a method for m...

Die attach methods and semiconductor devices manufactured based on...

Semiconductor die attach system and method

Attaching chip attach medium to already encapsulated electronic chip

Method of manufacturing a semiconductor component and semiconductor...

Arrangement of multiple power semiconductor chips and method of man...

Semiconductor devices, a semiconductor diode and a method for formi...

Laminate electronic device

Temporary mechanical stabilization of semiconductor cavities

Method for manufacturing a chip arrangement including a ceramic layer

Printed circuit boards having a dielectric layer which includes a p...

Semiconductor device having a sealant layer including carbon direct...

Chip package and method of forming a chip package

Embedding additive particles in encapsulant of electronic device

Insulated gate bipolar transistor comprising negative temperature c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Method and Structure for Supporting Thin Semiconductor Chips with a...

Methods for Manufacturing Electronic Devices

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Manufacturing a package using plateable encapsulant

METHODS FOR FORMING A CHIP PACKAGE

CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE

Semiconductor Die Attach System and Method

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Joining Materials, Electronic Devices and Methods for Manufacturing...

Power Semiconductor Devices and a Method for Forming a Power Semico...

TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES

Die Attach Methods and Semiconductor Devices Manufactured based on...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

Manufacturing a package using plateable encapsulant

Attaching chip attach medium to already encapsulated electronic chip

Printed Circuit Boards Having a Dielectric Layer Which Includes a P...

Semiconductor Device Including a Heat Sink Structure

TEMPERATURE SENSOR

Semiconductor Devices, a Semiconductor Diode and a Method for Formi...

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Micromechanical Semiconductor Sensing Device

ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MAN...

Method for Electrophoretically Depositing a Film on an Electronic A...

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT