Joachim Schober

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip, transponder and method of manufacturing a trans...
- Patent number 9,047,548
- Issue date Jun 2, 2015
- NXP B.V.
- Christian Scherabon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip card for insertion into a holder
- Patent number 8,695,881
- Issue date Apr 15, 2014
- NXP B.V.
- Joachim Heinz Schober
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic package assembly, method for disconnecting a microe...
- Patent number 8,659,132
- Issue date Feb 25, 2014
- NXP B.V.
- Joachim Heinz Schober
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Module base unit with strain relief means
- Patent number 7,733,657
- Issue date Jun 8, 2010
- NXP B.V.
- Reinhard Fritz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead-frame configuration for chips
- Patent number 7,245,005
- Issue date Jul 17, 2007
- NXP B.V.
- Rainer Moll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Product comprising product sub-parts connected to each other by a c...
- Patent number 7,124,956
- Issue date Oct 24, 2006
- Koninklijke Philips Electronics N.V.
- Rainer Moll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data carrier comprising an array of contacts
- Patent number 6,712,279
- Issue date Mar 30, 2004
- Koninklijke Philips Electronics N.V.
- Andreas Muehlberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer with process control modules
- Patent number 6,680,523
- Issue date Jan 20, 2004
- Joachim H. Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module having a lead frame equipped with components on both sides
- Patent number 6,643,142
- Issue date Nov 4, 2003
- Koninklijke Philips Electronics N.V.
- Gunter Aflenzer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip module with bond-wire connections with small loop height
- Patent number 6,593,664
- Issue date Jul 15, 2003
- Koninklijke Philips Electronics N.V.
- Joachim Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and device for determining the warpage of a wafer
- Patent number 6,567,169
- Issue date May 20, 2003
- Koninklijke Philips Electronics N.V.
- Joachim Schober
- G01 - MEASURING TESTING
Information Patent Grant
Data carrier with an integrated electronic component and with a tra...
- Patent number 6,552,422
- Issue date Apr 22, 2003
- Koninklijke Philips Electronics N.V.
- Joachim Heinz Schober
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data carrier module device having integrated circuit and transmissi...
- Patent number 6,285,561
- Issue date Sep 4, 2001
- U.S. Philips Corporation
- Günter Aflenzer
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE ASSEMBLY, METHOD FOR DISCONNECTING A MICROE...
- Publication number 20110204503
- Publication date Aug 25, 2011
- NXP B.V.
- Joachim Heinz Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip, Transponder and Method of Manufacturing a Trans...
- Publication number 20100224959
- Publication date Sep 9, 2010
- NXP B.V.
- Christian Scherabon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip card for insertion into a holder
- Publication number 20090200381
- Publication date Aug 13, 2009
- Koninklijke Philips Electronics N.V.
- Joachim Heinz Schober
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE BASE UNIT WITH STRAIN RELIEF MEANS
- Publication number 20090190314
- Publication date Jul 30, 2009
- Koninklijke Philips Electronics N.V.
- Reinhard Fritz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Module With At Least Two Pairs of Module Connecting Plates
- Publication number 20080149730
- Publication date Jun 26, 2008
- Koninklijke Philips Electronics N.V.
- Paul Hubmer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Lead-frame configuration for chips
- Publication number 20040174690
- Publication date Sep 9, 2004
- Rainer Moll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Product comprising product sub-parts connected to each other by a c...
- Publication number 20040144848
- Publication date Jul 29, 2004
- Rainer Moll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Product comprising a substrate and a chip attached to the substrate
- Publication number 20040140122
- Publication date Jul 22, 2004
- Rainer Moll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Data carrier comprising an array of contacts
- Publication number 20030024996
- Publication date Feb 6, 2003
- Koninklijke Philips Electronics N.V.
- Andreas Muehlberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip module with bond-wire connections with small loop height
- Publication number 20020135078
- Publication date Sep 26, 2002
- Koninklijke Philips Electronics N.V.
- Joachim Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with process control modules
- Publication number 20020117735
- Publication date Aug 29, 2002
- U.S. PHILIPS CORPORATION
- Joachim H. Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module having a lead frame equipped with components on both sides
- Publication number 20020075663
- Publication date Jun 20, 2002
- Gunter Aflenzer
- G06 - COMPUTING CALCULATING COUNTING

Joachim Schober

Person

Patents Grantslast 30 patents

Semiconductor chip, transponder and method of manufacturing a trans...

Chip card for insertion into a holder

Microelectronic package assembly, method for disconnecting a microe...

Module base unit with strain relief means

Lead-frame configuration for chips

Product comprising product sub-parts connected to each other by a c...

Data carrier comprising an array of contacts

Semiconductor wafer with process control modules

Module having a lead frame equipped with components on both sides

Chip module with bond-wire connections with small loop height

Method of and device for determining the warpage of a wafer

Data carrier with an integrated electronic component and with a tra...

Data carrier module device having integrated circuit and transmissi...

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGE ASSEMBLY, METHOD FOR DISCONNECTING A MICROE...

Semiconductor Chip, Transponder and Method of Manufacturing a Trans...

Chip card for insertion into a holder

MODULE BASE UNIT WITH STRAIN RELIEF MEANS

Module With At Least Two Pairs of Module Connecting Plates

Lead-frame configuration for chips

Product comprising product sub-parts connected to each other by a c...

Product comprising a substrate and a chip attached to the substrate

Data carrier comprising an array of contacts

Chip module with bond-wire connections with small loop height

Semiconductor wafer with process control modules

Module having a lead frame equipped with components on both sides