Joachim Wuerfl

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Zeuthen, DE

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Patents Grantslast 30 patents

Information Patent Grant
HEMT semiconductor component with field plates
- Patent number 8,866,191
- Issue date Oct 21, 2014
- Forschungsverbund Berlin e.V.
- Eldat Bahat-Treidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metallization having two multiple alternatin...
- Patent number 8,648,466
- Issue date Feb 11, 2014
- Forschungsverbund Berlin e.V.
- Victor Sidorov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing through-contacts in semi-conductor wafers via...
- Patent number 8,455,355
- Issue date Jun 4, 2013
- Forschungsverbund Berlin e.V.
- Olaf Krueger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A METALLIZATION HAVING TWO MULTIPLE ALTERNATIN...
- Publication number 20120080794
- Publication date Apr 5, 2012
- FORSCHUNGSVERBUND BERLIN E.V.
- Victor Sidorov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20110221011
- Publication date Sep 15, 2011
- Eldat Bahat-Treidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Through-Contacts in Semi-Conductor Wafers
- Publication number 20080286963
- Publication date Nov 20, 2008
- Olaf Krueger
- H01 - BASIC ELECTRIC ELEMENTS