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Joan Mach

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  • Sant Cugat del Valles, ES
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Patents Grantslast 30 patents

  • Information Patent Grant

    Distributing powder
    • Patent number 11,377,302
    • Issue date Jul 5, 2022
    • Hewlett-Packard Development Company, L.P.
    • Gerard Mosquera
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    3D build platform refill opening and cap
    • Patent number 11,285,668
    • Issue date Mar 29, 2022
    • Hewlett-Packard Development Company, L.P.
    • Marius Valles
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    DISTRIBUTING POWDER
    • Publication number 20210214167
    • Publication date Jul 15, 2021
    • Hewlett-Packard Development Company, L.P.
    • Gerard Mosquera
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    3D BUILD PLATFORM REFILL OPENING AND CAP
    • Publication number 20200290274
    • Publication date Sep 17, 2020
    • Hewlett-Packard Development Company, L.P.
    • Marius Valles
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL