Joan Rey V. BUOT

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Recess structure for padless stack via
- Patent number 12,230,552
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package employing added metal for embedded...
- Patent number 12,100,645
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects in a core layer configured for s...
- Patent number 11,955,409
- Issue date Apr 9, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal connection routing and method the same
- Patent number 11,832,391
- Issue date Nov 28, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-sided antenna module employing antennas on multiple sides of...
- Patent number 11,804,645
- Issue date Oct 31, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising passive component between substrates for improve...
- Patent number 11,791,276
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a package substrate with...
- Patent number 11,791,320
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-embedded trace structure with partially buried traces
- Patent number 11,764,076
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with stacked die wire bond connecti...
- Patent number 11,676,905
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising inter-substrate gradient interconnect structure
- Patent number 11,581,251
- Issue date Feb 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric structure in two-layer embedded trace substrate
- Patent number 11,342,254
- Issue date May 24, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular capacitor array
- Patent number 11,322,490
- Issue date May 3, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device orientation in core for improved power delivery in p...
- Patent number 11,302,656
- Issue date Apr 12, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and substrate comprising interconnects with semi-circular p...
- Patent number 11,296,022
- Issue date Apr 5, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, apparatus, and methods for heat dissipation
- Patent number 9,460,980
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Sun Yun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...
- Publication number 20250096091
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Chiao-Yi TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
- Publication number 20250098066
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK
- Publication number 20250096111
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...
- Publication number 20250079281
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...
- Publication number 20250070001
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
- Publication number 20250070086
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...
- Publication number 20250062203
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Hi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE
- Publication number 20250062246
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...
- Publication number 20250062235
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...
- Publication number 20240371737
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE
- Publication number 20240371775
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...
- Publication number 20240363513
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...
- Publication number 20240363514
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...
- Publication number 20240355712
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...
- Publication number 20240332146
- Publication date Oct 3, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS
- Publication number 20240321763
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH SOLDER RESIST POSTS
- Publication number 20240274516
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POCKET FANOUT PACKAGE
- Publication number 20240194545
- Publication date Jun 13, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FLEXIBLE SUBSTRATE
- Publication number 20240105687
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
- Publication number 20240105568
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...
- Publication number 20240047335
- Publication date Feb 8, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...
- Publication number 20240006369
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...
- Publication number 20230307336
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...
- Publication number 20230230908
- Publication date Jul 20, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS

Joan Rey V. BUOT

Person

Patents Grantslast 30 patents

Recess structure for padless stack via

Integrated circuit (IC) package employing added metal for embedded...

Circular bond finger pad

Substrate comprising interconnects in a core layer configured for s...

Terminal connection routing and method the same

Multi-sided antenna module employing antennas on multiple sides of...

Package comprising passive component between substrates for improve...

Integrated circuit (IC) packages employing a package substrate with...

Semi-embedded trace structure with partially buried traces

Integrated circuit (IC) package with stacked die wire bond connecti...

Package comprising inter-substrate gradient interconnect structure

Package comprising a substrate and interconnect device configured f...

Multi-dielectric structure in two-layer embedded trace substrate

Modular capacitor array

Passive device orientation in core for improved power delivery in p...

Package and substrate comprising interconnects with semi-circular p...

Systems, apparatus, and methods for heat dissipation

Patents Applicationslast 30 patents

PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...

PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK

PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK

PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...

DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...

PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...

STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...

INKJET PRINTING DEDICATED TEST PINS

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...

ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE

PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...

PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...

PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

INTERPOSER WITH SOLDER RESIST POSTS

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

METAL POCKET FANOUT PACKAGE

PACKAGE COMPRISING A FLEXIBLE SUBSTRATE

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...