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Joanna Christine Berndt
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Kokomo, IN, US
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last 30 patents
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Patent Grant
Flip chip on circuit board with enhanced heat dissipation and metho...
Patent number
6,156,980
Issue date
Dec 5, 2000
Delco Electronics Corp.
Darrel Eugene Peugh
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Microelectronic assembly having variable thickness solder joint
Publication number
20050252681
Publication date
Nov 17, 2005
Ronnie Joe Runyon
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...