Joaquin Torres

Person

Saint Martin Le Vinoux, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Copper diffusion barrier
- Patent number 8,729,701
- Issue date May 20, 2014
- STMicroelectronics (Crolles 2) SAS
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of self-aligned trenches in-between metal lines
- Patent number 8,470,685
- Issue date Jun 25, 2013
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with enhanced capacitance
- Patent number 8,424,177
- Issue date Apr 23, 2013
- STMicroelectronics (Crolles 2) SAS
- Alexis Farcy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control of carbon nanostructure growth in an interconnect structure
- Patent number 8,399,772
- Issue date Mar 19, 2013
- NXP B.V.
- Laurent Gosset
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fabrication of a diffusion barrier cap on copper containing conduct...
- Patent number 8,143,157
- Issue date Mar 27, 2012
- NXP B.V.
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal interconnects in a dielectric material
- Patent number 8,138,082
- Issue date Mar 20, 2012
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling lateral distribution of air gaps in interconnects
- Patent number 8,110,879
- Issue date Feb 7, 2012
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CuSiN/SiN diffusion barrier for copper in integrated-circuit devices
- Patent number 8,072,075
- Issue date Dec 6, 2011
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a reliable diffusion-barrier cap on a Cu-containing in...
- Patent number 7,989,342
- Issue date Aug 2, 2011
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper diffusion barrier
- Patent number 7,816,266
- Issue date Oct 19, 2010
- STMicroelectronics Crolles 2 SAS
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor
- Patent number 7,630,191
- Issue date Dec 8, 2009
- STMicroelectronics Crolles 2 SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling lateral distribution of air gaps in interconnects
- Patent number 7,605,071
- Issue date Oct 20, 2009
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration control and reliability enhancement of interconnect air...
- Patent number 7,553,739
- Issue date Jun 30, 2009
- STMicroelectronics (Corlles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an integrated electronic circuit that incor...
- Patent number 7,172,980
- Issue date Feb 6, 2007
- STMicroelectronics S.A.
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising an auxiliary component, for example a...
- Patent number 6,846,690
- Issue date Jan 25, 2005
- STMicroelectronics S.A.
- Alexis Farcy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Isolating trench and manufacturing process
- Patent number 6,828,646
- Issue date Dec 7, 2004
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating an integrated circuit
- Patent number 6,528,419
- Issue date Mar 4, 2003
- STMicroelectronics S.A.
- Srdjan Kordic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM CAPACITOR
- Publication number 20130286540
- Publication date Oct 31, 2013
- Alexis Farcy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR
- Publication number 20110080686
- Publication date Apr 7, 2011
- STMicroelectronics (Crolles 2) SAS
- Alexis Farcy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER DIFFUSION BARRIER
- Publication number 20110006430
- Publication date Jan 13, 2011
- STMicroelectronics (Crolles 2) SAS
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT
- Publication number 20100323477
- Publication date Dec 23, 2010
- STMicroelectronics S.A.
- Vincent Arnal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A RELIABLE DIFFUSION-BARRIER CAP ON A CU-CONTAINING IN...
- Publication number 20100120243
- Publication date May 13, 2010
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SELF-ALIGNED TRENCHES IN-BETWEEN METAL LINES
- Publication number 20100090346
- Publication date Apr 15, 2010
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION OF DIFFUSION BARRIER ON COPPER-CONTAINING INTERCONNECT ELE...
- Publication number 20100059889
- Publication date Mar 11, 2010
- NXP, B.V.
- Laurent Georges Gosset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A DIFFUSION BARRIER CAP ON COPPER CONTAINING CONDUCT...
- Publication number 20100044865
- Publication date Feb 25, 2010
- NXP B.V.
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING LATERAL DISTRIBUTION OF AIR GAPS IN INTERCONNECTS
- Publication number 20100038797
- Publication date Feb 18, 2010
- STMicroelectronics S.A.
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF CARBON NANOSTRUCTURE GROWTH IN AN INTERCONNECT STRUCTURE
- Publication number 20090272565
- Publication date Nov 5, 2009
- Laurent Gosset
- B82 - NANO-TECHNOLOGY
Information Patent Application
CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES
- Publication number 20090273085
- Publication date Nov 5, 2009
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTS IN A DIELECTRIC MATERIAL
- Publication number 20090218699
- Publication date Sep 3, 2009
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY IMPROVEMENT OF METAL-INTERCONNECT STRUCTURE BY CAPPING...
- Publication number 20090051033
- Publication date Feb 26, 2009
- NXP B.V.
- Laurent Gosset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER DIFFUSION BARRIER
- Publication number 20080280151
- Publication date Nov 13, 2008
- STMicroelectronics CROLLES 2 SAS
- Nicolas Jourdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT
- Publication number 20080179750
- Publication date Jul 31, 2008
- STMicroelectronics S.A.
- Vincent Arnal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitor
- Publication number 20070200197
- Publication date Aug 30, 2007
- STMicroelectronics CROLLES 2 SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated capacitor with a high breakdown voltage
- Publication number 20070096253
- Publication date May 3, 2007
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated electronic circuit incorporating a capacitor
- Publication number 20070063240
- Publication date Mar 22, 2007
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION CONTROL AND RELIABILITY ENHANCEMENT OF INTERCONNECT AIR...
- Publication number 20070054485
- Publication date Mar 8, 2007
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling lateral distribution of air gaps in interconnects
- Publication number 20070037380
- Publication date Feb 15, 2007
- STMicroelectronics (Crolles 2) SAS
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating an integrated electronic circuit that incor...
- Publication number 20040229454
- Publication date Nov 18, 2004
- STMicroelectronics S.A.
- Joaquin Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit comprising an auxiliary component, for example a...
- Publication number 20030119219
- Publication date Jun 26, 2003
- STMicroelectronics S.A.
- Alexis Farcy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Isolating trench and manufacturing process
- Publication number 20030098493
- Publication date May 29, 2003
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS

Joaquin Torres

Person

Patents Grantslast 30 patents

Copper diffusion barrier

Integration of self-aligned trenches in-between metal lines

MIM capacitor with enhanced capacitance

Control of carbon nanostructure growth in an interconnect structure

Fabrication of a diffusion barrier cap on copper containing conduct...

Method for forming metal interconnects in a dielectric material

Controlling lateral distribution of air gaps in interconnects

CuSiN/SiN diffusion barrier for copper in integrated-circuit devices

Formation of a reliable diffusion-barrier cap on a Cu-containing in...

Copper diffusion barrier

MIM capacitor

Controlling lateral distribution of air gaps in interconnects

Integration control and reliability enhancement of interconnect air...

Process for fabricating an integrated electronic circuit that incor...

Integrated circuit comprising an auxiliary component, for example a...

Isolating trench and manufacturing process

Process of fabricating an integrated circuit

Patents Applicationslast 30 patents

MIM CAPACITOR

MIM CAPACITOR

COPPER DIFFUSION BARRIER

INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT

FORMATION OF A RELIABLE DIFFUSION-BARRIER CAP ON A CU-CONTAINING IN...

INTEGRATION OF SELF-ALIGNED TRENCHES IN-BETWEEN METAL LINES

ADHESION OF DIFFUSION BARRIER ON COPPER-CONTAINING INTERCONNECT ELE...

FABRICATION OF A DIFFUSION BARRIER CAP ON COPPER CONTAINING CONDUCT...

CONTROLLING LATERAL DISTRIBUTION OF AIR GAPS IN INTERCONNECTS

CONTROL OF CARBON NANOSTRUCTURE GROWTH IN AN INTERCONNECT STRUCTURE

CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES

METAL INTERCONNECTS IN A DIELECTRIC MATERIAL

RELIABILITY IMPROVEMENT OF METAL-INTERCONNECT STRUCTURE BY CAPPING...

COPPER DIFFUSION BARRIER

INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT

MIM capacitor

Integrated capacitor with a high breakdown voltage

Integrated electronic circuit incorporating a capacitor

INTEGRATION CONTROL AND RELIABILITY ENHANCEMENT OF INTERCONNECT AIR...

Controlling lateral distribution of air gaps in interconnects

Process for fabricating an integrated electronic circuit that incor...

Integrated circuit comprising an auxiliary component, for example a...

Isolating trench and manufacturing process