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Job Ha

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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 11,227,835
    • Issue date Jan 18, 2022
    • Samsung Electronics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 10,854,561
    • Issue date Dec 1, 2020
    • Samsung Electronics Co., Ltd.
    • Mi Jin Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hybrid interposer and semiconductor package including the same
    • Patent number 10,811,358
    • Issue date Oct 20, 2020
    • SAMSUNG ELECTRO-MECHANICS CO. LTD.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 10,559,541
    • Issue date Feb 11, 2020
    • Samsung Electronics Co., Ltd.
    • Mi Jin Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    All-in-one power semiconductor module
    • Patent number 9,455,207
    • Issue date Sep 27, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwang Soo Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module package and method of manufacturing the same
    • Patent number 9,099,451
    • Issue date Aug 4, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number D717253
    • Issue date Nov 11, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Eun Jung Jo
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor device
    • Patent number D717256
    • Issue date Nov 11, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Ho Sohn
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor device
    • Patent number D717254
    • Issue date Nov 11, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Eun Jung Jo
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Wafer level device package with sealing line having electroconducti...
    • Patent number 7,911,043
    • Issue date Mar 22, 2011
    • Samsung Electro-Mechanics Co., Ltd.
    • Ju Pyo Hong
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200235058
    • Publication date Jul 23, 2020
    • Samsung Electronics Co., Ltd.
    • Mi Jin PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200203279
    • Publication date Jun 25, 2020
    • Samsung Electronics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20200168552
    • Publication date May 28, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Job HA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20190393168
    • Publication date Dec 26, 2019
    • Samsung Electronics Co., Ltd.
    • Mi Jin PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME
    • Publication number 20150228567
    • Publication date Aug 13, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20150144991
    • Publication date May 28, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20150145123
    • Publication date May 28, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE
    • Publication number 20140138839
    • Publication date May 22, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ALL-IN-ONE POWER SEMICONDUCTOR MODULE
    • Publication number 20140118956
    • Publication date May 1, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwang Soo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20140001613
    • Publication date Jan 2, 2014
    • SAMSUNG ELECTRO-MECHANIC CO., LTD.
    • Job HA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE MODULE
    • Publication number 20130285232
    • Publication date Oct 31, 2013
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20130147027
    • Publication date Jun 13, 2013
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20130134569
    • Publication date May 30, 2013
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Job Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer level device package with sealing line having electroconducti...
    • Publication number 20080290479
    • Publication date Nov 27, 2008
    • Samsung Electro-Mechanics Co., Ltd.
    • Ju Pyo Hong
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Wafer level package and wafer level packaging method
    • Publication number 20080283989
    • Publication date Nov 20, 2008
    • SAMSUNG ELECTRO-MECANICS CO., LTD.
    • Won Kyu Jeung
    • H01 - BASIC ELECTRIC ELEMENTS