Jochen Dangelmaier

Person

Beratzhausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Current sensor
- Patent number 11,835,600
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- G01 - MEASURING TESTING
Information Patent Grant
Photoacoustic sensors and MEMS devices
- Patent number 11,573,204
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with selective corrosion protection of electric connection...
- Patent number 11,410,942
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising identifier on and/or in carrier
- Patent number 11,239,176
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device with a routable molded lead frame
- Patent number 11,073,572
- Issue date Jul 27, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device and method for fabricating the same
- Patent number 10,818,805
- Issue date Oct 27, 2020
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded lead frame sensor package
- Patent number 10,781,095
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Jochen Dangelmaier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 10,297,536
- Issue date May 21, 2019
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor arrangement, battery cell and energy system
- Patent number 10,107,867
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Klaus Elian
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pre-mold for a microphone assembly and method of producing the same
- Patent number 9,986,354
- Issue date May 29, 2018
- Infineon Technologies AG
- Thomas Mueller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for determining a state of a rechargeable battery or of a...
- Patent number 9,748,611
- Issue date Aug 29, 2017
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 9,704,786
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device
- Patent number 9,658,296
- Issue date May 23, 2017
- Infineon Technologies AG
- Udo Ausserlechner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 9,059,083
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor package having a stacked die arrangement
- Patent number 9,013,013
- Issue date Apr 21, 2015
- Infineon Technologies AG
- Sebastian Beer
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a component and device comprising a component
- Patent number 8,872,314
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a micro-electro-mechanical microphone
- Patent number 8,767,983
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a component and device having a component
- Patent number 8,482,135
- Issue date Jul 9, 2013
- Infineon Technologies AG
- Horst Theuss
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 7,964,448
- Issue date Jun 21, 2011
- Infineon Technologies AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with gold coatings, and process for producing it
- Patent number 7,911,041
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and apparatus for production of a semicondu...
- Patent number 7,838,989
- Issue date Nov 23, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with chip through-contacts
- Patent number 7,786,577
- Issue date Aug 31, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector module and method of manufacturing the same
- Patent number 7,766,560
- Issue date Aug 3, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing and apparatus for improving the bonding betwe...
- Patent number 7,732,333
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device with sensor chip and method for produci...
- Patent number 7,732,915
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Jochen Dangelmaier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CURRENT SENSOR
- Publication number 20240061054
- Publication date Feb 22, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- G01 - MEASURING TESTING
Information Patent Application
PHOTOACOUSTIC SENSORS AND MEMS DEVICES
- Publication number 20230116926
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRASONIC TOUCH SENSOR
- Publication number 20230010130
- Publication date Jan 12, 2023
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CURRENT SENSOR
- Publication number 20220404440
- Publication date Dec 22, 2022
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- G01 - MEASURING TESTING
Information Patent Application
SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES
- Publication number 20210300749
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOACOUSTIC SENSORS AND MEMS DEVICES
- Publication number 20210181151
- Publication date Jun 17, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SELECTIVE CORROSION PROTECTION OF ELECTRIC CONNECTION...
- Publication number 20210028125
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING IDENTIFIER ON AND/OR IN CARRIER
- Publication number 20200335451
- Publication date Oct 22, 2020
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR DEVICE WITH A ROUTABLE MOLDED LEAD FRAME
- Publication number 20200233044
- Publication date Jul 23, 2020
- INFINEON TECHNOLOGIES AG
- Jochen DANGELMAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEAD FRAME SENSOR PACKAGE
- Publication number 20200189908
- Publication date Jun 18, 2020
- INFINEON TECHNOLOGIES AG
- Jochen DANGELMAIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Sensor Device and Method for Fabricating the Same
- Publication number 20190148566
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20170271245
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20170092569
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACT...
- Publication number 20160282212
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Sebastian Beer
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150279782
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM
- Publication number 20150226810
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD
- Publication number 20150132614
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current Sensor Device
- Publication number 20150015249
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Udo AUSSERLECHNER
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...
- Publication number 20150004451
- Publication date Jan 1, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
Pre-mold for a microphone assembly and method of producing the same
- Publication number 20150001646
- Publication date Jan 1, 2015
- INFINEON TECHNOLOGIES AG
- Thomas MUELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A COMPONENT AND DEVICE COMPRISING A COMPONENT
- Publication number 20130277864
- Publication date Oct 24, 2013
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC FIELD CURRENT SENSORS
- Publication number 20120146165
- Publication date Jun 14, 2012
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Application
Electronic Device and Method of Manufacturing Same
- Publication number 20100065961
- Publication date Mar 18, 2010
- Klaus ELIAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090072379
- Publication date Mar 19, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE
- Publication number 20080298621
- Publication date Dec 4, 2008
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for Producing and Apparatus for Improving the Bonding Betwe...
- Publication number 20080258281
- Publication date Oct 23, 2008
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS

Jochen Dangelmaier

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Microelectromechanical system (MEMS) sensor packages and methods fo...

Current sensor

Photoacoustic sensors and MEMS devices

Package with selective corrosion protection of electric connection...

Package comprising identifier on and/or in carrier

Current sensor device with a routable molded lead frame

Direct selective adhesion promotor plating

Method of forming an electrical contact and method of forming a chi...

Semiconductor sensor device and method for fabricating the same

Molded lead frame sensor package

Chip package and method of forming a chip package with a metal cont...

Direct selective adhesion promotor plating

Sensor arrangement, battery cell and energy system

Pre-mold for a microphone assembly and method of producing the same

Apparatus for determining a state of a rechargeable battery or of a...

Direct selective adhesion promotor plating

Current sensor device

Semiconductor device

Pressure sensor package having a stacked die arrangement

Method for producing a component and device comprising a component

Module including a micro-electro-mechanical microphone

Method for producing a component and device having a component

Electronic device and method of manufacturing same

Semiconductor device with gold coatings, and process for producing it

Semiconductor component and apparatus for production of a semicondu...

Component with chip through-contacts

Connector module and method of manufacturing the same

Process for producing and apparatus for improving the bonding betwe...

Semiconductor sensor device with sensor chip and method for produci...

Patents Applicationslast 30 patents

CURRENT SENSOR

PHOTOACOUSTIC SENSORS AND MEMS DEVICES

ULTRASONIC TOUCH SENSOR

CURRENT SENSOR

SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES

PHOTOACOUSTIC SENSORS AND MEMS DEVICES

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

PACKAGE WITH SELECTIVE CORROSION PROTECTION OF ELECTRIC CONNECTION...

PACKAGE COMPRISING IDENTIFIER ON AND/OR IN CARRIER

CURRENT SENSOR DEVICE WITH A ROUTABLE MOLDED LEAD FRAME

MOLDED LEAD FRAME SENSOR PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

Direct Selective Adhesion Promotor Plating

Semiconductor Sensor Device and Method for Fabricating the Same

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

Direct Selective Adhesion Promotor Plating

Direct Selective Adhesion Promotor Plating

MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACT...

SEMICONDUCTOR DEVICE

SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM

SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD

Current Sensor Device

APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...

Pre-mold for a microphone assembly and method of producing the same

METHOD FOR PRODUCING A COMPONENT AND DEVICE COMPRISING A COMPONENT

MAGNETIC FIELD CURRENT SENSORS

Electronic Device and Method of Manufacturing Same

SEMICONDUCTOR DEVICE

MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE

Process for Producing and Apparatus for Improving the Bonding Betwe...