Jochen Schacht

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Back end interconnect with a shaped interface
- Patent number 7,494,915
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit, including forming a contact
- Patent number 7,348,279
- Issue date Mar 25, 2008
- Infineon Technologies AG
- Uwe Paul Schröder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayered metal hardmasks for use in dual damascene etch schemes
- Patent number 7,241,681
- Issue date Jul 10, 2007
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure and method
- Patent number 7,125,792
- Issue date Oct 24, 2006
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end interconnect with a shaped interface
- Patent number 7,122,462
- Issue date Oct 17, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure and method
- Patent number 7,091,612
- Issue date Aug 15, 2006
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayered metal hardmasks for use in Dual Damascene etch schemes
- Patent number 7,052,621
- Issue date May 30, 2006
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK END INTERCONNECT WITH A SHAPED INTERFACE
- Publication number 20060292852
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayered metal hardmasks for use in dual damascene etch schemes
- Publication number 20060113278
- Publication date Jun 1, 2006
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for formation of a contact in a semiconductor wafer
- Publication number 20060110903
- Publication date May 25, 2006
- Infineon Technologies AG
- Uwe Paul Schroder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back End Interconnect With a Shaped Interface
- Publication number 20050112864
- Publication date May 26, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene structure and method
- Publication number 20050079706
- Publication date Apr 14, 2005
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene structure and method
- Publication number 20050077628
- Publication date Apr 14, 2005
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayered metal hardmasks for use in dual damascene etch schemes
- Publication number 20040251234
- Publication date Dec 16, 2004
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Jochen Schacht

Person

Patents Grantslast 30 patents

Back end interconnect with a shaped interface

Method of making an integrated circuit, including forming a contact

Bilayered metal hardmasks for use in dual damascene etch schemes

Dual damascene structure and method

Back end interconnect with a shaped interface

Dual damascene structure and method

Bilayered metal hardmasks for use in Dual Damascene etch schemes

Patents Applicationslast 30 patents

BACK END INTERCONNECT WITH A SHAPED INTERFACE

Bilayered metal hardmasks for use in dual damascene etch schemes

Method for formation of a contact in a semiconductor wafer

Back End Interconnect With a Shaped Interface

Dual damascene structure and method

Dual damascene structure and method

Bilayered metal hardmasks for use in dual damascene etch schemes