Jochen Tomaschko

Person

Herrenberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics device and method for producing a microelectronics...
- Patent number 11,870,369
- Issue date Jan 9, 2024
- Robert Bosch GmbH
- Jochen Tomaschko
- G02 - OPTICS
Information Patent Grant
Method for forming a cavity and a component having a cavity
- Patent number 10,840,107
- Issue date Nov 17, 2020
- Robert Bosch GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a cavity and a component having a cavity
- Patent number 10,431,474
- Issue date Oct 1, 2019
- Robert Bosch GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer equipped with transparent plates
- Patent number 9,663,351
- Issue date May 30, 2017
- Robert Bosch GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for a piezoelectric layer arrangement and corr...
- Patent number 9,461,234
- Issue date Oct 4, 2016
- Robert Bosch GmbH
- Thomas Mayer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL DEVICE
- Publication number 20230152572
- Publication date May 18, 2023
- ROBERT BOSCH GmbH
- Frank Schatz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTRONIC DEVICE
- Publication number 20230065179
- Publication date Mar 2, 2023
- ROBERT BOSCH GmbH
- Jochen Tomaschko
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER
- Publication number 20220238791
- Publication date Jul 28, 2022
- ROBERT BOSCH GmbH
- Daniel Monteiro Diniz Reis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER
- Publication number 20220231219
- Publication date Jul 21, 2022
- ROBERT BOSCH GmbH
- Daniel Monteiro Diniz Reis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE AND METHOD FOR PRODUCING A MICROELECTRONICS...
- Publication number 20210328524
- Publication date Oct 21, 2021
- ROBERT BOSCH GmbH
- Jochen Tomaschko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A WAFER CONNECTION
- Publication number 20210292160
- Publication date Sep 23, 2021
- ROBERT BOSCH GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND STRUCTURES ON MEMS ELEMENT AND ASIC ELEMENT
- Publication number 20200399116
- Publication date Dec 24, 2020
- ROBERT BOSCH GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A CAVITY AND A COMPONENT HAVING A CAVITY
- Publication number 20190348300
- Publication date Nov 14, 2019
- ROBERT BOSCH GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A CAVITY AND A COMPONENT HAVING A CAVITY
- Publication number 20170140943
- Publication date May 18, 2017
- ROBERT BOSCH GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR A PIEZOELECTRIC LAYER ARRANGEMENT AND CORR...
- Publication number 20160035959
- Publication date Feb 4, 2016
- ROBERT BOSCH GmbH
- Thomas MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a wafer equipped with transparent plates
- Publication number 20150232328
- Publication date Aug 20, 2015
- ROBERT BOSCH GmbH
- Simon ARMBRUSTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jochen Tomaschko

Person

Patents Grantslast 30 patents

Method for producing a wafer connection

Microelectronics device and method for producing a microelectronics...

Method for forming a cavity and a component having a cavity

Method for forming a cavity and a component having a cavity

Method for producing a wafer equipped with transparent plates

Manufacturing method for a piezoelectric layer arrangement and corr...

Patents Applicationslast 30 patents

MICROMECHANICAL DEVICE

METHOD FOR PRODUCING A MICROELECTRONIC DEVICE

SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER

SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER

MICROELECTRONICS DEVICE AND METHOD FOR PRODUCING A MICROELECTRONICS...

METHOD FOR PRODUCING A WAFER CONNECTION

BOND STRUCTURES ON MEMS ELEMENT AND ASIC ELEMENT

METHOD FOR FORMING A CAVITY AND A COMPONENT HAVING A CAVITY

METHOD FOR FORMING A CAVITY AND A COMPONENT HAVING A CAVITY

MANUFACTURING METHOD FOR A PIEZOELECTRIC LAYER ARRANGEMENT AND CORR...

Method for producing a wafer equipped with transparent plates