Joe L. Martinez Jr.

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a two-sided fluid cooled assembly
- Patent number 9,003,649
- Issue date Apr 14, 2015
- MaxQ Technology, LLC
- Guillermo L. Romero
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a fluid cooled assembly
- Patent number 8,966,759
- Issue date Mar 3, 2015
- MaxQ Technology, LLC
- Guillermo L. Romero
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly for removing heat from a semiconductor device
- Patent number 6,154,369
- Issue date Nov 28, 2000
- Motorola, Inc.
- Joe Luis Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module for removing heat from a semiconductor die
- Patent number 5,565,705
- Issue date Oct 15, 1996
- Motorola, Inc.
- Guillermo L. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coupling a power lead to a bond pad in an electronic module
- Patent number 5,544,412
- Issue date Aug 13, 1996
- Motorola, Inc.
- Guillermo L. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a heat dissipation apparatus
- Patent number 5,533,257
- Issue date Jul 9, 1996
- Motorola, Inc.
- Guillermo L. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum chuck with venturi jet for converting positive pressure to a...
- Patent number 5,421,595
- Issue date Jun 6, 1995
- Motorola, Inc.
- Jerry D. Cripe
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication number 20190388997
- Publication date Dec 26, 2019
- MaxQ Technology, LLC
- Joe L. Martinez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Joe L. Martinez Jr.

Person

Patents Grantslast 30 patents

Method of making a two-sided fluid cooled assembly

Method of making a fluid cooled assembly

Electronic assembly for removing heat from a semiconductor device

Electronic module for removing heat from a semiconductor die

Method for coupling a power lead to a bond pad in an electronic module

Method for forming a heat dissipation apparatus

Vacuum chuck with venturi jet for converting positive pressure to a...

Patents Applicationslast 30 patents

LOAD SENSING FOR FRICTION WELDING