Joe Lee

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 12,183,634
- Issue date Dec 31, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve FAV RIE process margin and electrom...
- Patent number 12,033,892
- Issue date Jul 9, 2024
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 11,837,501
- Issue date Dec 5, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ash processes for via formation to suppress damage to low-K l...
- Patent number 11,721,578
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve FAV RIE process margin and Electrom...
- Patent number 11,710,658
- Issue date Jul 25, 2023
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Completion mechanism for a microprocessor instruction completion table
- Patent number 11,366,671
- Issue date Jun 21, 2022
- International Business Machines Corporation
- Kenneth L. Ward
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 11,257,717
- Issue date Feb 22, 2022
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 11,164,815
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Svia using a single damascene interconnect
- Patent number 11,037,822
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve FAV RIE process margin and Electrom...
- Patent number 10,985,056
- Issue date Apr 20, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve FAV RIE process margin and electrom...
- Patent number 10,957,584
- Issue date Mar 23, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 10,832,952
- Issue date Nov 10, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for completing atomic instructions in a microprocessor
- Patent number 10,831,489
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Kenneth L. Ward
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Completion mechanism for a microprocessor instruction completion table
- Patent number 10,725,786
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Kenneth L. Ward
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanism to stop completions using stop codes in an instruction co...
- Patent number 10,713,057
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Kenneth L. Ward
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming a straight via profile with precise critical dime...
- Patent number 10,672,705
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrica...
- Patent number 10,643,859
- Issue date May 5, 2020
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 10,636,706
- Issue date Apr 28, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a straight via profile with precise critical dime...
- Patent number 10,622,301
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition and nitridization of bottom electrode metal fo...
- Patent number 10,347,825
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition and nitridization of bottom electrode metal fo...
- Patent number 10,312,434
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 10,276,436
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal silicate spacers for fully aligned vias
- Patent number 10,211,138
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective blocking boundary placement for circuit locations requiri...
- Patent number 10,170,416
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch
- Patent number 10,121,676
- Issue date Nov 6, 2018
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal silicate spacers for fully aligned vias
- Patent number 10,049,974
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of super via structure in BEOL
- Patent number 10,020,254
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of super via structure in BEOL
- Patent number 10,020,255
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to improve FAV RIE process margin and electrom...
- Patent number 9,953,865
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrica...
- Patent number 9,934,984
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- Publication number 20240429103
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20240347383
- Publication date Oct 17, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20240145299
- Publication date May 2, 2024
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FOR PRECISE TUNING OF MANDRELS
- Publication number 20240038535
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Joe Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20220181205
- Publication date Jun 9, 2022
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20220028797
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20210210380
- Publication date Jul 8, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT ASH PROCESSES FOR VIA FORMATION TO SUPPRESS DAMAGE TO LOW-K L...
- Publication number 20210151350
- Publication date May 20, 2021
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20210098388
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20210082758
- Publication date Mar 18, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA USING A SINGLE DAMASCENE INTERCONNECT
- Publication number 20200357692
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETION MECHANISM FOR A MICROPROCESSOR INSTRUCTION COMPLETION TABLE
- Publication number 20200241880
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Kenneth L. WARD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING A STRAIGHT VIA PROFILE WITH PRECISE CRITICAL DIME...
- Publication number 20200066632
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM TO STOP COMPLETIONS USING STOP CODES IN AN INSTRUCTION CO...
- Publication number 20200065110
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Kenneth L. WARD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANISM FOR COMPLETING ATOMIC INSTRUCTIONS IN A MICROPROCESSOR
- Publication number 20200065103
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Kenneth L. WARD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPLETION MECHANISM FOR A MICROPROCESSOR INSTRUCTION COMPLETION TABLE
- Publication number 20200065102
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Kenneth L. WARD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING A STRAIGHT VIA PROFILE WITH PRECISE CRITICAL DIME...
- Publication number 20200058585
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROFLUOROCARBON GAS-ASSISTED PLASMA ETCH FOR INTERCONNECT FABRICA...
- Publication number 20190013209
- Publication date Jan 10, 2019
- International Business Machines Corporation
- ROBERT L. BRUCE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20180315654
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20180315653
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS
- Publication number 20180269144
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION AND NITRIDIZATION OF BOTTOM ELECTRODE METAL FO...
- Publication number 20180240968
- Publication date Aug 23, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION AND NITRIDIZATION OF BOTTOM ELECTRODE METAL FO...
- Publication number 20180240971
- Publication date Aug 23, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20180122691
- Publication date May 3, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20180122692
- Publication date May 3, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROFLUOROCARBON GAS-ASSISTED PLASMA ETCH FOR INTERCONNECT FABRICA...
- Publication number 20180122649
- Publication date May 3, 2018
- International Business Machines Corporation
- ROBERT L. BRUCE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20180114723
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BLOCKING BOUNDARY PLACEMENT FOR CIRCUIT LOCATIONS REQUIRI...
- Publication number 20180114750
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS
- Publication number 20180061750
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20180040510
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Selective recessing to form a fully aligned via

Structure and method to improve FAV RIE process margin and electrom...

Selective recessing to form a fully aligned via

Split ash processes for via formation to suppress damage to low-K l...

Structure and method to improve FAV RIE process margin and Electrom...

Completion mechanism for a microprocessor instruction completion table

Selective recessing to form a fully aligned via

Bottom barrier free interconnects without voids

Svia using a single damascene interconnect

Structure and method to improve FAV RIE process margin and Electrom...

Structure and method to improve FAV RIE process margin and electrom...

Selective recessing to form a fully aligned via

Mechanism for completing atomic instructions in a microprocessor

Completion mechanism for a microprocessor instruction completion table

Mechanism to stop completions using stop codes in an instruction co...

Method of forming a straight via profile with precise critical dime...

Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrica...

Selective recessing to form a fully aligned via

Method of forming a straight via profile with precise critical dime...

Selective deposition and nitridization of bottom electrode metal fo...

Selective deposition and nitridization of bottom electrode metal fo...

Selective recessing to form a fully aligned via

Metal silicate spacers for fully aligned vias

Selective blocking boundary placement for circuit locations requiri...

Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch

Metal silicate spacers for fully aligned vias

Integration of super via structure in BEOL

Integration of super via structure in BEOL

Structure and method to improve FAV RIE process margin and electrom...

Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrica...

Patents Applicationslast 30 patents

BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

METAL HARD MASK FOR PRECISE TUNING OF MANDRELS

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

Bottom Barrier Free Interconnects Without Voids

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

SPLIT ASH PROCESSES FOR VIA FORMATION TO SUPPRESS DAMAGE TO LOW-K L...

Bottom Barrier Free Interconnects Without Voids

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

SVIA USING A SINGLE DAMASCENE INTERCONNECT

COMPLETION MECHANISM FOR A MICROPROCESSOR INSTRUCTION COMPLETION TABLE

METHOD OF FORMING A STRAIGHT VIA PROFILE WITH PRECISE CRITICAL DIME...

MECHANISM TO STOP COMPLETIONS USING STOP CODES IN AN INSTRUCTION CO...

MECHANISM FOR COMPLETING ATOMIC INSTRUCTIONS IN A MICROPROCESSOR

COMPLETION MECHANISM FOR A MICROPROCESSOR INSTRUCTION COMPLETION TABLE

METHOD OF FORMING A STRAIGHT VIA PROFILE WITH PRECISE CRITICAL DIME...

HYDROFLUOROCARBON GAS-ASSISTED PLASMA ETCH FOR INTERCONNECT FABRICA...

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS

SELECTIVE DEPOSITION AND NITRIDIZATION OF BOTTOM ELECTRODE METAL FO...

SELECTIVE DEPOSITION AND NITRIDIZATION OF BOTTOM ELECTRODE METAL FO...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

HYDROFLUOROCARBON GAS-ASSISTED PLASMA ETCH FOR INTERCONNECT FABRICA...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

SELECTIVE BLOCKING BOUNDARY PLACEMENT FOR CIRCUIT LOCATIONS REQUIRI...

METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA