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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Packaging structure of image sensor and method for packaging the same
Patent number
6,737,720
Issue date
May 18, 2004
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package structure of image sensor
Patent number
6,627,983
Issue date
Sep 30, 2003
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module card and a method for manufacturing the same
Patent number
6,565,008
Issue date
May 20, 2003
Kingpak Technology Inc.
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME
Publication number
20030071129
Publication date
Apr 17, 2003
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging structure of image sensors and method for packaging the same
Publication number
20020096763
Publication date
Jul 25, 2002
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked package structure of image sensor
Publication number
20020096729
Publication date
Jul 25, 2002
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging structure of image sensor and method for packaging the same
Publication number
20020096758
Publication date
Jul 25, 2002
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked package structure of image sensor
Publication number
20020096753
Publication date
Jul 25, 2002
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure of a photosensor and method for packaging the same
Publication number
20020060287
Publication date
May 23, 2002
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS