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Joe Pin Wang
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Long Grove, IL, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die bond design for medium pressure sensor
Patent number
10,035,703
Issue date
Jul 31, 2018
Continental Automotive Systems, Inc.
Joe Pin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro-electromechanical pressure sensor having reduced thermally-in...
Patent number
8,796,866
Issue date
Aug 5, 2014
Continential Automotive Systems, Inc.
Joe Pin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microdevice assembly having a fine grain getter layer for maintaini...
Patent number
6,867,543
Issue date
Mar 15, 2005
Motorola, Inc.
Joe P. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of separating and handling a thin semiconductor die on a wafer
Patent number
6,772,509
Issue date
Aug 10, 2004
Motorola, Inc.
Shiuh-Hui Steven Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Strain gauge
Patent number
6,427,539
Issue date
Aug 6, 2002
Motorola, Inc.
Shiuh-Hui Steven Chen
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
DIE BOND DESIGN FOR MEDIUM PRESSURE SENSOR
Publication number
20150091107
Publication date
Apr 2, 2015
CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
Joe Pin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTROMECHANICAL PRESSURE SENSOR HAVING REDUCED THERMALLY-IN...
Publication number
20140103468
Publication date
Apr 17, 2014
CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
Joe Pin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Microdevice assembly having a fine grain getter layer for maintaini...
Publication number
20040189198
Publication date
Sep 30, 2004
Joe P. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method of separating and handling a thin semiconductor die on a wafer
Publication number
20030140486
Publication date
Jul 31, 2003
Shiuh-Hui Steven Chen
G06 - COMPUTING CALCULATING COUNTING