Joe Siegel

Person

Brookline, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with beyond reticle field conductor pads
- Patent number 9,806,014
- Issue date Oct 31, 2017
- Advanced Micro Devices, Inc.
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant scannable glitch latch
- Patent number 8,850,278
- Issue date Sep 30, 2014
- Advanced Micro Devices, Inc.
- Kevin M. Gillespie
- G01 - MEASURING TESTING
Information Patent Grant
Thermal management of stacked semiconductor chips with electrically...
- Patent number 8,704,353
- Issue date Apr 22, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking, testing and packaging for yield
- Patent number 8,451,014
- Issue date May 28, 2013
- Advanced Micro Devices, Inc.
- Bryan Black
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER TRANSMISSION LINE USING MULTIPLE METAL LAYERS
- Publication number 20180130780
- Publication date May 10, 2018
- Advanced Micro Devices
- DEAN GONZALES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS
- Publication number 20170213787
- Publication date Jul 27, 2017
- Michael S. Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CAPACITOR
- Publication number 20170092712
- Publication date Mar 30, 2017
- Joseph R. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20160365335
- Publication date Dec 15, 2016
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH IDENTIFICATION SYSTEM
- Publication number 20130341783
- Publication date Dec 26, 2013
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...
- Publication number 20130256872
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...
- Publication number 20130256913
- Publication date Oct 3, 2013
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT TOLERANT SCANNABLE GLITCH LATCH
- Publication number 20120166899
- Publication date Jun 28, 2012
- Advanced Micro Devices, Inc.
- Kevin M. Gillespie
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20120061821
- Publication date Mar 15, 2012
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE
- Publication number 20120043539
- Publication date Feb 23, 2012
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor chip with redundant thru-silicon-vias

Semiconductor chip with redundant thru-silicon-vias

Interposer with beyond reticle field conductor pads

Semiconductor chip with thermal interface tape

Semiconductor chip with redundant thru-silicon-vias

Fault tolerant scannable glitch latch

Thermal management of stacked semiconductor chips with electrically...

Die stacking, testing and packaging for yield

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

INTERPOSER TRANSMISSION LINE USING MULTIPLE METAL LAYERS

INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS

VIA CAPACITOR

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

INTERPOSER WITH IDENTIFICATION SYSTEM

THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...

FAULT TOLERANT SCANNABLE GLITCH LATCH

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE