Joel A. Auernheimer

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a substrate core with embedded capacitor and stru...
- Patent number 9,572,258
- Issue date Feb 14, 2017
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array capacitors for broadband decoupling applications
- Patent number 7,495,336
- Issue date Feb 24, 2009
- Intel Corporation
- Joel A. Auernheimer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array capacitor with resistive structure
- Patent number 7,365,428
- Issue date Apr 29, 2008
- Intel Corporation
- Joel A Auernheimer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array capacitor for decoupling multiple voltage rails
- Patent number 7,355,836
- Issue date Apr 8, 2008
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex tape architecture for integrated circuit signal ingress/egress
- Patent number 7,321,167
- Issue date Jan 22, 2008
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a substrate core with embedded capacitor and structures for...
- Patent number 7,224,571
- Issue date May 29, 2007
- Intel Corporation
- Sriram Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array with socket plate
- Patent number 7,114,959
- Issue date Oct 3, 2006
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Array capacitors for broadband decoupling applications, and methods...
- Publication number 20070152301
- Publication date Jul 5, 2007
- Intel Corporation
- Joel A. Auernheimer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array capacitor for decoupling multiple voltage rails
- Publication number 20060274479
- Publication date Dec 7, 2006
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a substrate core with embedded capacitor and structures for...
- Publication number 20060143887
- Publication date Jul 6, 2006
- Sriram Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming a substrate core with embedded capacitor and structures for...
- Publication number 20060146476
- Publication date Jul 6, 2006
- Sriram Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming a substrate core with embedded capacitor and structures for...
- Publication number 20060143886
- Publication date Jul 6, 2006
- Sriram Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Array capacitor with resistive structure
- Publication number 20060087030
- Publication date Apr 27, 2006
- Intel Corporation
- Joel A. Auernheimer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array with socket plate
- Publication number 20060046527
- Publication date Mar 2, 2006
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flex tape architecture for integrated circuit signal ingress/egress
- Publication number 20040245610
- Publication date Dec 9, 2004
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Joel A. Auernheimer

Person

Patents Grantslast 30 patents

Method of forming a substrate core with embedded capacitor and stru...

Array capacitors for broadband decoupling applications

Array capacitor with resistive structure

Array capacitor for decoupling multiple voltage rails

Flex tape architecture for integrated circuit signal ingress/egress

Forming a substrate core with embedded capacitor and structures for...

Land grid array with socket plate

Patents Applicationslast 30 patents

Array capacitors for broadband decoupling applications, and methods...

Array capacitor for decoupling multiple voltage rails

Forming a substrate core with embedded capacitor and structures for...

Forming a substrate core with embedded capacitor and structures for...

Forming a substrate core with embedded capacitor and structures for...

Array capacitor with resistive structure

Land grid array with socket plate

Flex tape architecture for integrated circuit signal ingress/egress