Joel A. Gerber

Person

Orono, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solvent assisted burnishing of pre-underfilled solder bumped wafers...
- Patent number 7,170,185
- Issue date Jan 30, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit elements using z-axis interconnect
- Patent number 6,791,036
- Issue date Sep 14, 2004
- 3M Innovative Properties Company
- Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for making z-axis electrical connections
- Patent number 6,260,264
- Issue date Jul 17, 2001
- 3M Innovative Properties Company
- Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electronic package
- Patent number 6,246,010
- Issue date Jun 12, 2001
- 3M Innovative Properties Company
- Robert L. D. Zenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making circuit elements for a z-axis interconnect
- Patent number 6,063,647
- Issue date May 16, 2000
- 3M Innovative Properties Company
- Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a Z axis interconnect circuit
- Patent number 5,873,161
- Issue date Feb 23, 1999
- Minnesota Mining and Manufacturing Company
- Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a Z-axis adhesive and establishing electrical in...
- Patent number 5,685,939
- Issue date Nov 11, 1997
- Minnesota Mining and Manufacturing Company
- Martin B. Wolk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical interconnections between adjacent c...
- Patent number 5,601,678
- Issue date Feb 11, 1997
- Minnesota Mining and Manufacturing Company
- Joel A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnections between adjacent circuit board layers o...
- Patent number 5,401,913
- Issue date Mar 28, 1995
- Minnesota Mining and Manufacturing Company
- Joel A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers...
- Publication number 20070102827
- Publication date May 10, 2007
- 3M Innovative Properties Company
- Peter B. Hogerton
- H01 - BASIC ELECTRIC ELEMENTS

Joel A. Gerber

Person

Patents Grantslast 30 patents

Solvent assisted burnishing of pre-underfilled solder bumped wafers...

Circuit elements using z-axis interconnect

Methods for making z-axis electrical connections

High density electronic package

Method for making circuit elements for a z-axis interconnect

Method of making a Z axis interconnect circuit

Process for making a Z-axis adhesive and establishing electrical in...

Method for providing electrical interconnections between adjacent c...

Electrical interconnections between adjacent circuit board layers o...

Patents Applicationslast 30 patents

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers...