Joel M. Sharrow

Person

South Hero, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cleaning of semiconductor wafers by contaminate encapsulation
- Patent number 7,531,059
- Issue date May 12, 2009
- International Business Machines Corporation
- Nicole S Carpenter
- B08 - CLEANING
Information Patent Grant
Method and apparatus for etch rate uniformity control
- Patent number 6,992,014
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Casey J. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for surface preparation of workpieces utilizing fluid separa...
- Patent number 6,939,408
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Francis A. Abramovich
- B08 - CLEANING
Information Patent Grant
Method of fabricating a narrow polysilicon line
- Patent number 6,884,722
- Issue date Apr 26, 2005
- International Business Machines Corporation
- Casey J. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning of semiconductor wafers by contaminate encapsulation
- Patent number 6,776,171
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Nicole S. Carpenter
- B08 - CLEANING
Information Patent Grant
Backside protection films
- Patent number 6,670,283
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Faye D. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for combined particle location and removal
- Patent number 6,356,653
- Issue date Mar 12, 2002
- International Business Machines Corporation
- Jeffrey A. Brigante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reworking copper metallurgy in semiconductor devices
- Patent number 6,340,601
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Thomas F. Curran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Cleaning of semiconductor wafers by contaminate encapsulation
- Publication number 20040169012
- Publication date Sep 2, 2004
- International Business Machines Corporation
- Nicole S. Carpenter
- B08 - CLEANING
Information Patent Application
Method and apparatus for etch rate uniformity control
- Publication number 20040092128
- Publication date May 13, 2004
- International Business Machines Corporation
- Casey J. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a narrow polysilicon line
- Publication number 20040077169
- Publication date Apr 22, 2004
- International Business Machines Corporation
- Casey J. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside protection films
- Publication number 20030096507
- Publication date May 22, 2003
- Faye D. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning of semiconductor wafers by contaminate encapsulation
- Publication number 20030000547
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Nicole S. Carpenter
- B08 - CLEANING
Information Patent Application
METHOD AND APPARATUS FOR COMBINED PARTICLE LOCATION AND REMOVAL
- Publication number 20010043734
- Publication date Nov 22, 2001
- JEFFREY A. BRIGANTE
- H01 - BASIC ELECTRIC ELEMENTS

Joel M. Sharrow

Person

Patents Grantslast 30 patents

Cleaning of semiconductor wafers by contaminate encapsulation

Method and apparatus for etch rate uniformity control

Method for surface preparation of workpieces utilizing fluid separa...

Method of fabricating a narrow polysilicon line

Cleaning of semiconductor wafers by contaminate encapsulation

Backside protection films

Method and apparatus for combined particle location and removal

Method for reworking copper metallurgy in semiconductor devices

Patents Applicationslast 30 patents

Cleaning of semiconductor wafers by contaminate encapsulation

Method and apparatus for etch rate uniformity control

Method of fabricating a narrow polysilicon line

Backside protection films

Cleaning of semiconductor wafers by contaminate encapsulation

METHOD AND APPARATUS FOR COMBINED PARTICLE LOCATION AND REMOVAL