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Joep Stokkermans
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Nijmegen, NL
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Patents Grants
last 30 patents
Information
Patent Grant
Device, apparatus and system
Patent number
10,998,804
Issue date
May 4, 2021
NEXPERIA, B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wirebonding method and apparatus
Patent number
8,474,680
Issue date
Jul 2, 2013
Invensas Corporation
Thomas M. Kampschreur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip transfer method and apparatus
Patent number
7,726,011
Issue date
Jun 1, 2010
NXP B.V.
Johannes Wilhelmus Dorotheus Bosch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gravity compensation device for a chip transfer apparatus
Patent number
7,677,523
Issue date
Mar 16, 2010
NXP B.V.
Joep Stokkermans
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wirebonding method and apparatus
Patent number
7,578,425
Issue date
Aug 25, 2009
NXP B.V.
Thomas Markus Kampschreur
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TRANSFER DEVICE FOR TRANSFERRING AN ELECTRONIC COMPONENT
Publication number
20230402308
Publication date
Dec 14, 2023
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT TRANSFER BY LEVITATION
Publication number
20230402302
Publication date
Dec 14, 2023
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURVED WAFER STAGE
Publication number
20230260954
Publication date
Aug 17, 2023
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM FRAME CARRIER FOR A CURVED WAFER STAGE
Publication number
20230260819
Publication date
Aug 17, 2023
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-SCALE PACKAGE
Publication number
20230230892
Publication date
Jul 20, 2023
NEXPERIA B.V.
Regnerus Hermannus Poelma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
Publication number
20220020670
Publication date
Jan 20, 2022
NEXPERIA B.V.
Hartmut Bünning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
Publication number
20220020679
Publication date
Jan 20, 2022
NEXPERIA B.V.
Hartmut Bünning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, APPARATUS AND SYSTEM
Publication number
20200195111
Publication date
Jun 18, 2020
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIREBONDING METHOD AND APPARATUS
Publication number
20090277950
Publication date
Nov 12, 2009
NXP B.V.
THOMAS Markus KAMPSCHREUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Gravity Compensation Device
Publication number
20080061275
Publication date
Mar 13, 2008
Joep Stokkermans
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Chip transfer method and apparatus
Publication number
20070137031
Publication date
Jun 21, 2007
Johannes Wilhelmus Dorotheus Bosch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wirebonding method and apparatus
Publication number
20060016860
Publication date
Jan 26, 2006
Koninklijke Philips Electronics N.V.
Thomas Kampschreur
H01 - BASIC ELECTRIC ELEMENTS