Joerg Busch

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for stabilizing a semiconductor arrangement
- Patent number 11,081,384
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a metal pad structure of a die, a method f...
- Patent number 8,765,531
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization layer for a power semiconductor device
- Patent number 7,737,560
- Issue date Jun 15, 2010
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for fabricating
- Patent number 7,276,803
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Stabilizing a Semiconductor Arrangement
- Publication number 20190326155
- Publication date Oct 24, 2019
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization layer for a power semiconductor device
- Publication number 20070267749
- Publication date Nov 22, 2007
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method for fabricating
- Publication number 20050127534
- Publication date Jun 16, 2005
- Infineon Technologies AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS