Joerg-Eric Sagmeister

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RUESCHLIKON, CH

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with edge soldering for high-density packages...
- Patent number 10,098,241
- Issue date Oct 9, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH EDGE SOLDERING FOR HIGH-DENSITY PACKAGES...
- Publication number 20190037707
- Publication date Jan 31, 2019
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH EDGE SOLDERING FOR HIGH-DENSITY PACKAGES...
- Publication number 20170118839
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR