Joerg Ortner

Person

Drobollach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of implanting an implant species into a substrate at differe...
- Patent number 11,640,908
- Issue date May 2, 2023
- Infineon Technologies AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,189,539
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle and exposure method including projection of a reticle patte...
- Patent number 10,802,404
- Issue date Oct 13, 2020
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of dicing a wafer
- Patent number 9,704,748
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device comprising trench structures
- Patent number 9,496,339
- Issue date Nov 15, 2016
- Infineon Technologies Austria AG
- Minghao Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,339,868
- Issue date May 17, 2016
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of making a semiconductor chip including identifying marks
- Patent number 9,171,806
- Issue date Oct 27, 2015
- Infineon Technologies AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark definer
- Patent number 9,165,889
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing a semiconductor co...
- Patent number 9,142,444
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,126,260
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of processing a substrate
- Patent number 9,034,233
- Issue date May 19, 2015
- Infineon Technologies AG
- Joerg Ortner
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER
- Publication number 20230282596
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Andreas Kleinbichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING AN ALIGNMENT STRUCTURE
- Publication number 20230275033
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus Having a Functional Structure Delimited by a Frame Struct...
- Publication number 20220013424
- Publication date Jan 13, 2022
- INFINEON TECHNOLOGIES AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Implanting an Implant Species into a Substrate at Differe...
- Publication number 20200373163
- Publication date Nov 26, 2020
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS HAVING A FUNCTIONAL STRUCTURE DELIMITED BY A FRAME STRUCT...
- Publication number 20190378776
- Publication date Dec 12, 2019
- INFINEON TECHNOLOGIES AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...
- Publication number 20180267408
- Publication date Sep 20, 2018
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20170309565
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Dicing a Wafer
- Publication number 20160379884
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING TRENCH STRUCTURES
- Publication number 20150349056
- Publication date Dec 3, 2015
- Infineon Technologies Austria AG
- Minghao Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark Definer
- Publication number 20150000149
- Publication date Jan 1, 2015
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140220257
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140216677
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...
- Publication number 20130323905
- Publication date Dec 5, 2013
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a substrate
- Publication number 20120133084
- Publication date May 31, 2012
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Semiconductor component and method for producing a semiconductor co...
- Publication number 20100078716
- Publication date Apr 1, 2010
- Erwin Bacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING IDENTIFYING MARKS
- Publication number 20090315193
- Publication date Dec 24, 2009
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS

Joerg Ortner

Person

Patents Grantslast 30 patents

Apparatus having a functional structure delimited by a frame struct...

Method of implanting an implant species into a substrate at differe...

Apparatus having a functional structure delimited by a frame struct...

Reticle and exposure method including projection of a reticle patte...

Method of dicing a wafer

Semiconductor device comprising trench structures

Method of processing a substrate

Method of making a semiconductor chip including identifying marks

Alignment mark definer

Semiconductor component and method for producing a semiconductor co...

Method of processing a substrate

Method of processing a substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER

SEMICONDUCTOR SUBSTRATE HAVING AN ALIGNMENT STRUCTURE

Apparatus Having a Functional Structure Delimited by a Frame Struct...

Method of Implanting an Implant Species into a Substrate at Differe...

APPARATUS HAVING A FUNCTIONAL STRUCTURE DELIMITED BY A FRAME STRUCT...

RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Method of Dicing a Wafer

SEMICONDUCTOR DEVICE COMPRISING TRENCH STRUCTURES

Alignment Mark Definer

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A SUBSTRATE

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR CO...

Method of processing a substrate

Semiconductor component and method for producing a semiconductor co...

SEMICONDUCTOR CHIP INCLUDING IDENTIFYING MARKS