Joey Chiu

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Chung-Li City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a low-K dual damascene interconnect structure
- Patent number 7,435,685
- Issue date Oct 14, 2008
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching of carbon-doped low-k dielectrics
- Patent number 7,256,134
- Issue date Aug 14, 2007
- Applied Materials, Inc.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a low-K dual damascene interconnect structure
- Patent number 7,132,369
- Issue date Nov 7, 2006
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A LOW-K DUAL DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20080145998
- Publication date Jun 19, 2008
- Applied Materials, Inc.
- GERARDO A. DELGADINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective etching of carbon-doped low-k dielectrics
- Publication number 20050026430
- Publication date Feb 3, 2005
- APPLIED MATERIALS, INC.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a low-K dual damascene interconnect structure
- Publication number 20040157453
- Publication date Aug 12, 2004
- APPLIED MATERIALS, INC.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS