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Johann Gatterbauer
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Parsberg, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Chip package and method of forming a chip package
Patent number
12,040,288
Issue date
Jul 16, 2024
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package
Patent number
11,735,534
Issue date
Aug 22, 2023
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
Patent number
11,424,201
Issue date
Aug 23, 2022
Infineon Technologies AG
Michael Rogalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a layer structure, layer structure, method of for...
Patent number
11,328,935
Issue date
May 10, 2022
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier for power metallization in semiconductor devices
Patent number
11,127,693
Issue date
Sep 21, 2021
Infineon Technologies AG
Johann Gatterbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming an electrical contact and method of forming a chi...
Patent number
10,978,418
Issue date
Apr 13, 2021
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package with a metal cont...
Patent number
10,461,056
Issue date
Oct 29, 2019
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
Patent number
10,049,994
Issue date
Aug 14, 2018
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip device
Patent number
9,875,978
Issue date
Jan 23, 2018
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for making a semiconductor chip device
Patent number
9,502,248
Issue date
Nov 22, 2016
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive pads and methods of formation thereof
Patent number
9,362,216
Issue date
Jun 7, 2016
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive pads and methods of formation thereof
Patent number
9,082,626
Issue date
Jul 14, 2015
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
Patent number
8,822,327
Issue date
Sep 2, 2014
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a metal pad structure of a die, a method f...
Patent number
8,765,531
Issue date
Jul 1, 2014
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad sidewall spacers and method of making pad sidewall spacers
Patent number
8,736,062
Issue date
May 27, 2014
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20240371796
Publication date
Nov 7, 2024
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20230395532
Publication date
Dec 7, 2023
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20210375792
Publication date
Dec 2, 2021
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
Publication number
20210082861
Publication date
Mar 18, 2021
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming a Layer Structure, Layer Structure, Method of For...
Publication number
20200227278
Publication date
Jul 16, 2020
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Barrier for Power Metallization in Semiconductor Devices
Publication number
20200111754
Publication date
Apr 9, 2020
Johann Gatterbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
Publication number
20200013749
Publication date
Jan 9, 2020
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
Publication number
20180366427
Publication date
Dec 20, 2018
INFINEON TECHNOLOGIES AG
Michael Rogalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
Publication number
20170338169
Publication date
Nov 23, 2017
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE
Publication number
20170110423
Publication date
Apr 20, 2017
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Pads and Methods of Formation Thereof
Publication number
20150287668
Publication date
Oct 8, 2015
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Pads and Methods of Formation Thereof
Publication number
20150028461
Publication date
Jan 29, 2015
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
Publication number
20140319689
Publication date
Oct 30, 2014
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
Publication number
20140054800
Publication date
Feb 27, 2014
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
Publication number
20140048941
Publication date
Feb 20, 2014
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
Publication number
20140048958
Publication date
Feb 20, 2014
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS