Johann Winderl

Person

Wackersdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for connecting at least one chip to an externa...
- Patent number 7,036,216
- Issue date May 2, 2006
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a semiconductor chip to a carrier element
- Patent number 7,008,493
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with stacked semiconductor chips
- Patent number 6,894,378
- Issue date May 17, 2005
- Infineon Technologies AG
- Johann Winderl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with a semiconductor chip and method of produc...
- Patent number 6,891,252
- Issue date May 10, 2005
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying a semiconductor chip to a carrier element wi...
- Patent number 6,664,648
- Issue date Dec 16, 2003
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for the installation of an integrated circuit in an inje...
- Patent number 6,614,100
- Issue date Sep 2, 2003
- Infineon Technologies AG
- Christian Hauser
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for mounting a semiconductor chip on a carrier layer and dev...
- Patent number 6,534,345
- Issue date Mar 18, 2003
- Infineon Technologies AG
- Simon Muff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and a sheet strip for packaging bonding wire con...
- Patent number 6,525,416
- Issue date Feb 25, 2003
- Infineon Technologies AG
- Christian Hauser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device for packaging electronic components
- Patent number 6,521,988
- Issue date Feb 18, 2003
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier having ventilation channels
- Patent number 6,486,538
- Issue date Nov 26, 2002
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding conductors, in particular beam leads
- Patent number 6,430,809
- Issue date Aug 13, 2002
- Infineon Technologies AG
- Monika Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with method for manufacturing
- Patent number 6,429,537
- Issue date Aug 6, 2002
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singling semiconductor components and semiconductor comp...
- Patent number 6,364,751
- Issue date Apr 2, 2002
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for applying a semiconductor chip to a carrier element
- Publication number 20040074585
- Publication date Apr 22, 2004
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for connecting at least one chip to an externa...
- Publication number 20030066188
- Publication date Apr 10, 2003
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a semiconductor chip and method of produc...
- Publication number 20020167078
- Publication date Nov 14, 2002
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with stacked semiconductor chips
- Publication number 20020121687
- Publication date Sep 5, 2002
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic devices and a sheet strip for packaging bonding wire con...
- Publication number 20020041017
- Publication date Apr 11, 2002
- Christian Hauser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Device for packaging electronic components
- Publication number 20010045641
- Publication date Nov 29, 2001
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method for manufacturing it
- Publication number 20010036720
- Publication date Nov 1, 2001
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for applying a semiconductor chip to a carrier...
- Publication number 20010031512
- Publication date Oct 18, 2001
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS

Johann Winderl

Person

Patents Grantslast 30 patents

Method and apparatus for connecting at least one chip to an externa...

Method for applying a semiconductor chip to a carrier element

Electronic component with stacked semiconductor chips

Electronic component with a semiconductor chip and method of produc...

Apparatus for applying a semiconductor chip to a carrier element wi...

Lead frame for the installation of an integrated circuit in an inje...

Method for mounting a semiconductor chip on a carrier layer and dev...

Electronic devices and a sheet strip for packaging bonding wire con...

Device for packaging electronic components

Chip carrier having ventilation channels

Method for bonding conductors, in particular beam leads

Semiconductor component with method for manufacturing

Method for singling semiconductor components and semiconductor comp...

Patents Applicationslast 30 patents

Method for applying a semiconductor chip to a carrier element

Method and apparatus for connecting at least one chip to an externa...

Electronic component with a semiconductor chip and method of produc...

Electronic component with stacked semiconductor chips

Electronic devices and a sheet strip for packaging bonding wire con...

Device for packaging electronic components

Semiconductor component and method for manufacturing it

Method and apparatus for applying a semiconductor chip to a carrier...