Johannes Cobussen

Person

Beuningen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,881,425
- Issue date Jan 23, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 11,721,586
- Issue date Aug 8, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,658,056
- Issue date May 23, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,508,606
- Issue date Nov 22, 2022
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical control modules for integrated circuit device patterning an...
- Patent number 10,942,444
- Issue date Mar 9, 2021
- NXP USA, INC.
- Leendertjan Mekking
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit saw bow break point
- Patent number 10,896,878
- Issue date Jan 19, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES
- Publication number 20230326796
- Publication date Oct 12, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20230061529
- Publication date Mar 2, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Regulating Plasma Dicing Rates
- Publication number 20210193524
- Publication date Jun 24, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- G01 - MEASURING TESTING
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20210134647
- Publication date May 6, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20210134648
- Publication date May 6, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Saw Bow Break Point
- Publication number 20200402918
- Publication date Dec 24, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONTROL MODULES FOR INTEGRATED CIRCUIT DEVICE PATTERNING AN...
- Publication number 20200348587
- Publication date Nov 5, 2020
- NXP USA, Inc.
- Leendertjan Mekking
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Johannes Cobussen

Person

Patents Grantslast 30 patents

Method and system for regulating plasma dicing rates

Technique for handling diced wafers of integrated circuits

Method and system for regulating plasma dicing rates

Technique for handling diced wafers of integrated circuits

Technique for handling diced wafers of integrated circuits

Optical control modules for integrated circuit device patterning an...

Integrated circuit saw bow break point

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

Method and System for Regulating Plasma Dicing Rates

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

Integrated Circuit Saw Bow Break Point

OPTICAL CONTROL MODULES FOR INTEGRATED CIRCUIT DEVICE PATTERNING AN...