Johannes Lodermeyer

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for producing packaged semiconductor devices
- Patent number 10,923,364
- Issue date Feb 16, 2021
- Infineon Technologies AG
- Kristina Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two power semiconductor chips and manufacturing th...
- Patent number 9,331,060
- Issue date May 3, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two power semiconductor chips and manufacturing th...
- Patent number 8,975,711
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,603,864
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package
- Patent number 7,989,930
- Issue date Aug 2, 2011
- Infineon Technologies AG
- Edmund Riedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an integrated circuit including electrodeposition...
- Patent number 7,909,978
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20190074198
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Kristina MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Embedded Packages with Backside Die Connection
- Publication number 20150194362
- Publication date Jul 9, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Power Semiconductor Chips and Manufacturing Th...
- Publication number 20150155271
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Power Semiconductor Chips and Manufacturing Th...
- Publication number 20130146991
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100059857
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108423
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257743
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257744
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Johannes Lodermeyer

Person

Patents Grantslast 30 patents

Methods for producing packaged semiconductor devices

Chip-embedded packages with backside die connection

Device including two power semiconductor chips and manufacturing th...

Device including two power semiconductor chips and manufacturing th...

Method of fabricating a semiconductor device

Semiconductor package

Method of making an integrated circuit including electrodeposition...

Patents Applicationslast 30 patents

METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES

Chip-Embedded Packages with Backside Die Connection

Device Including Two Power Semiconductor Chips and Manufacturing Th...

Device Including Two Power Semiconductor Chips and Manufacturing Th...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...