Johannes Lodermeyer

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Kinding, DE

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Patents Grantslast 30 patents

Information Patent Grant
Tilted chip assembly for optical devices
- Patent number 10,571,682
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Ludwig Heitzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tilted chip assembly for optical devices
- Patent number 10,539,779
- Issue date Jan 21, 2020
- Infineon Technologies AG
- Ludwig Heitzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
TILTED CHIP ASSEMBLY FOR OPTICAL DEVICES
- Publication number 20190049716
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Ludwig HEITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
- Publication number 20170283247
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY