Johannes RUDOLPH

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Bad Lausick, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for contacting and packetising a semiconductor chip
- Patent number 11,749,638
- Issue date Sep 5, 2023
- Technische Universität Chemnitz
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVELY MANUFACTURED AIR GAP WINDING FOR AN ELECTRICAL MACHINE
- Publication number 20240186858
- Publication date Jun 6, 2024
- Maxon International AG
- Johannes RUDOLPH
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Method for Contacting and Packetising a Semiconductor Chip
- Publication number 20220181291
- Publication date Jun 9, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for Producing a Component by Means of 3D Multi-Ma...
- Publication number 20210060863
- Publication date Mar 4, 2021
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRIC WINDING FOR ELECTRIC ENERGY CONVERTERS OR MACHINES, METHOD...
- Publication number 20140077648
- Publication date Mar 20, 2014
- Patrick BRÄUER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER