Johannes Wilhelmus Dorotheus Bosch

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Nijmegen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Device for packaging an electronic component
- Patent number 7,823,369
- Issue date Nov 2, 2010
- NXP B.V.
- Johannes Wilhelmus Dorotheus Bosch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip transfer method and apparatus
- Patent number 7,726,011
- Issue date Jun 1, 2010
- NXP B.V.
- Johannes Wilhelmus Dorotheus Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and device for packaging electronic components thus packaged
- Patent number 7,340,872
- Issue date Mar 11, 2008
- NXP, B.V.
- Johannes Wilhelmus Dorotheus Bosch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE
- Publication number 20100117171
- Publication date May 13, 2010
- NXP, B.V.
- Paulus Martinus Catharina Hesen
- G01 - MEASURING TESTING
Information Patent Application
Device for Packaging an Electronic Component
- Publication number 20080127610
- Publication date Jun 5, 2008
- NXP B.V.
- Johannes Wilhelmus Dorotheus Bosch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip transfer method and apparatus
- Publication number 20070137031
- Publication date Jun 21, 2007
- Johannes Wilhelmus Dorotheus Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and device for packaging electronic components thus packaged
- Publication number 20050035025
- Publication date Feb 17, 2005
- Johannes Wilhelmus Dorotheus Bosch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR