John A. Andresakis

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayered construction for use in resistors and capacitors
- Patent number 7,862,900
- Issue date Jan 4, 2011
- Oak-Mitsui Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayered construction for use in resistors and...
- Patent number 7,596,842
- Issue date Oct 6, 2009
- Oak-Mitsui Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered construction for resistor and capacitor formation
- Patent number 7,192,654
- Issue date Mar 20, 2007
- Oak-Mitsui Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of an embedded capacitor plane using a thin dielectric
- Patent number 6,657,849
- Issue date Dec 2, 2003
- Oak-Mitsui, Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate adhesion enhancement to film
- Patent number 6,629,348
- Issue date Oct 7, 2003
- Oak-Mitsui, Inc.
- Edward C. Skorupski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel coated copper as electrodes for embedded passive devices
- Patent number 6,610,417
- Issue date Aug 26, 2003
- Oak-Mitsui, Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process to manufacturing tight tolerance embedded elements for prin...
- Patent number 6,606,792
- Issue date Aug 19, 2003
- Oak-Mitsui, Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of printed circuits using single layer processing techn...
- Patent number 6,500,349
- Issue date Dec 31, 2002
- Oak-Mitsui, Inc.
- John Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing fire retardant circuit boards without the use of fire...
- Patent number 6,495,244
- Issue date Dec 17, 2002
- Oak-Mitsui, Inc.
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING MULTILAYERED CONSTRUCTION FOR USE IN RESISTORS AND...
- Publication number 20090314531
- Publication date Dec 24, 2009
- JOHN A. ANDRESAKIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered construction for resistor and capacitor formation
- Publication number 20060188701
- Publication date Aug 24, 2006
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making multilayered construction for use in resistors and...
- Publication number 20060185140
- Publication date Aug 24, 2006
- John A. Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit heaters with ultrathin low resistivity materials
- Publication number 20040075528
- Publication date Apr 22, 2004
- OAK-MITSUI, Inc.
- Derek C. Carbin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nickel coated copper as electrodes for embedded passive devices
- Publication number 20030068517
- Publication date Apr 10, 2003
- John A. Andresakis
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate adhesion enhancement to film
- Publication number 20020162218
- Publication date Nov 7, 2002
- OAK-MITSUI, Inc.
- Edward C. Skorupski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacture of printed circuits using single layer processing techn...
- Publication number 20020079288
- Publication date Jun 27, 2002
- OAK-MITSUI, Inc.
- John Andresakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

John A. Andresakis

Person

Patents Grantslast 30 patents

Multilayered construction for use in resistors and capacitors

Method of making multilayered construction for use in resistors and...

Multilayered construction for resistor and capacitor formation

Formation of an embedded capacitor plane using a thin dielectric

Substrate adhesion enhancement to film

Nickel coated copper as electrodes for embedded passive devices

Process to manufacturing tight tolerance embedded elements for prin...

Manufacture of printed circuits using single layer processing techn...

Manufacturing fire retardant circuit boards without the use of fire...

Patents Applicationslast 30 patents

METHOD OF MAKING MULTILAYERED CONSTRUCTION FOR USE IN RESISTORS AND...

Multilayered construction for resistor and capacitor formation

Method of making multilayered construction for use in resistors and...

Printed circuit heaters with ultrathin low resistivity materials

Nickel coated copper as electrodes for embedded passive devices

Substrate adhesion enhancement to film

Manufacture of printed circuits using single layer processing techn...