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John A. Forthun
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Glendora, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Chip stack with differing chip package types
Patent number
6,908,792
Issue date
Jun 21, 2005
Staktek Group L.P.
Ted Bruce
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of assembling a stackable integrated circuit chip
Patent number
6,660,561
Issue date
Dec 9, 2003
DPAC Technologies Corp.
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip stack with differing chip package types
Patent number
6,627,984
Issue date
Sep 30, 2003
Dense-Pac Microsystems, Inc.
Ted Bruce
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable chip package with flex carrier
Patent number
6,473,308
Issue date
Oct 29, 2002
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable chip package with flex carrier
Patent number
6,262,895
Issue date
Jul 17, 2001
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular panel stacking process
Patent number
5,869,353
Issue date
Feb 9, 1999
Dense-Pac Microsystems, Inc.
Aaron Uri Levy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip stack and method of making same
Patent number
5,612,570
Issue date
Mar 18, 1997
Dense-Pac Microsystems, Inc.
Floyd K. Eide
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Chip stack with differing chip package types
Publication number
20030025211
Publication date
Feb 6, 2003
Ted Bruce
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip stack with differing chip package types
Publication number
20030020153
Publication date
Jan 30, 2003
Ted Bruce
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mechanically registered and interconnected chip
Publication number
20020185724
Publication date
Dec 12, 2002
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module with one side stacked memory
Publication number
20020089831
Publication date
Jul 11, 2002
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable chip package with flex carrier
Publication number
20010015487
Publication date
Aug 23, 2001
John A. Forthun
H01 - BASIC ELECTRIC ELEMENTS