John A. Griesemer

Person

Salt Point, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromigration monitor
- Patent number 10,794,948
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration monitor
- Patent number 10,677,833
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration monitor
- Patent number 9,891,261
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for monitoring dielectric reliability with t...
- Patent number 9,404,953
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 9,059,167
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced capture pads for through semiconductor vias
- Patent number 9,040,418
- Issue date May 26, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 8,859,390
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced capture pads for through semiconductor vias
- Patent number 8,772,949
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit design checking for three dimensional chip technology
- Patent number 8,386,977
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhanced electromigration resistance in TSV structure and design
- Patent number 8,288,270
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced electromigration resistance in TSV structure and design
- Patent number 8,237,288
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20180074110
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20180074111
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20150380326
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
Structures and Methds for Monitoring Dielectric Reliability With Th...
- Publication number 20150115982
- Publication date Apr 30, 2015
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20140339703
- Publication date Nov 20, 2014
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
- Publication number 20140124946
- Publication date May 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
- Publication number 20140127904
- Publication date May 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY
- Publication number 20120304138
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN
- Publication number 20120199975
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN
- Publication number 20120199983
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20110193197
- Publication date Aug 11, 2011
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS

John A. Griesemer

Person

Patents Grantslast 30 patents

Electromigration monitor

Electromigration monitor

Electromigration monitor

Structures and methods for monitoring dielectric reliability with t...

Structure and method for making crack stop for 3D integrated circuits

Enhanced capture pads for through semiconductor vias

Structure and method for making crack stop for 3D integrated circuits

Enhanced capture pads for through semiconductor vias

Circuit design checking for three dimensional chip technology

Enhanced electromigration resistance in TSV structure and design

Enhanced electromigration resistance in TSV structure and design

Patents Applicationslast 30 patents

ELECTROMIGRATION MONITOR

ELECTROMIGRATION MONITOR

ELECTROMIGRATION MONITOR

Structures and Methds for Monitoring Dielectric Reliability With Th...

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS

ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS

CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY

ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN

ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS