John A. Harada

Follow

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing fixture for a ramp-stack chip package using solder fo...
- Patent number 8,373,280
- Issue date Feb 12, 2013
- Oracle America, Inc.
- John A. Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical communication in a ramp-stack chip package
- Patent number 8,290,319
- Issue date Oct 16, 2012
- Oracle America, Inc.
- John A. Harada
- G02 - OPTICS
Information Patent Grant
Ramp-stack chip package with static bends
- Patent number 8,283,766
- Issue date Oct 9, 2012
- Oracle America, Inc.
- John A. Harada
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH STATIC BENDS
- Publication number 20120056327
- Publication date Mar 8, 2012
- Oracle International Corporation
- John A. Harada
- G02 - OPTICS
Information Patent Application
MANUFACTURING FIXTURE FOR A RAMP-STACK CHIP PACKAGE
- Publication number 20120049376
- Publication date Mar 1, 2012
- Oracle International Corporation
- John A. Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION IN A RAMP-STACK CHIP PACKAGE
- Publication number 20120051695
- Publication date Mar 1, 2012
- Oracle International Corporation
- John A. Harada
- G02 - OPTICS