John A. Meyer

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Rohnert Park, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for minimizing semiconductor wafer arcing duri...
- Patent number 6,406,925
- Issue date Jun 18, 2002
- Tegal Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for minimizing semiconductor wafer arcing duri...
- Patent number 6,346,428
- Issue date Feb 12, 2002
- Tegal Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS