John A. Rice

Person

Long Lake, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrodeposition of high damping magnetic alloys
- Patent number 11,913,130
- Issue date Feb 27, 2024
- Seagate Technology LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition of thermally stable alloys
- Patent number 11,798,583
- Issue date Oct 24, 2023
- Seagate Technology LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition of high damping magnetic alloys
- Patent number 11,377,749
- Issue date Jul 5, 2022
- Seagate Technology LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition of thermally stable alloys
- Patent number 11,152,020
- Issue date Oct 19, 2021
- Seagate Technology LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited high-magnetic-moment material at writer gap pole
- Patent number 6,778,357
- Issue date Aug 17, 2004
- Seagate Technology LLC
- Ibro Tabakovic
- G11 - INFORMATION STORAGE
Information Patent Grant
Composite structure with single domain magnetic element, and thin f...
- Patent number 5,995,336
- Issue date Nov 30, 1999
- North American Philips Corporation
- Paul F. Michalek
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of making composite structure with single domain magnetic el...
- Patent number 5,269,895
- Issue date Dec 14, 1993
- North American Philips Corporation
- Paul F. Michalek
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODEPOSITION OF HIGH DAMPING MAGNETIC ALLOYS
- Publication number 20190112722
- Publication date Apr 18, 2019
- SEAGATE TECHNOLOGY LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited high-magnetic-moment material at writer gap pole
- Publication number 20020145824
- Publication date Oct 10, 2002
- Ibro Tabakovic
- B82 - NANO-TECHNOLOGY
Information Patent Application
HGA ballbond assembly with wafer process assembly features
- Publication number 20020057531
- Publication date May 16, 2002
- Seagate Technology LLC
- Richard L. Segar
- G11 - INFORMATION STORAGE

John A. Rice

Person

Patents Grantslast 30 patents

Electrodeposition of high damping magnetic alloys

Electrodeposition of thermally stable alloys

Electrodeposition of high damping magnetic alloys

Electrodeposition of thermally stable alloys

Electrodeposited high-magnetic-moment material at writer gap pole

Composite structure with single domain magnetic element, and thin f...

Method of making composite structure with single domain magnetic el...

Patents Applicationslast 30 patents

ELECTRODEPOSITION OF HIGH DAMPING MAGNETIC ALLOYS

Electrodeposited high-magnetic-moment material at writer gap pole

HGA ballbond assembly with wafer process assembly features