John Aguada

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for die removal from plastic packages
- Patent number 7,067,332
- Issue date Jun 27, 2006
- Altera Corporation
- Vijay Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW STRESS PLANE DESIGN FOR IC PACKAGE SUBSTRATE
- Publication number 20230103147
- Publication date Mar 30, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR