John Baird

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low-profile ball-grid array semiconductor package and method
- Patent number 5,639,695
- Issue date Jun 17, 1997
- Motorola, Inc.
- Tim Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic interconnect for electronic device and method for making
- Patent number 5,583,747
- Issue date Dec 10, 1996
- John H. Baird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile ball-grid array semiconductor package
- Patent number 5,541,450
- Issue date Jul 30, 1996
- Motorola, Inc.
- Tim Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device and method
- Patent number 5,535,510
- Issue date Jul 16, 1996
- Motorola Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device
- Patent number 5,523,629
- Issue date Jun 4, 1996
- Motorola, Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package capable of spreading heat
- Patent number 5,397,917
- Issue date Mar 14, 1995
- Motorola, Inc.
- Denise M. Ommen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated microelectronic device and method
- Patent number 5,378,928
- Issue date Jan 3, 1995
- Motorola, Inc.
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 5,252,783
- Issue date Oct 12, 1993
- Motorola, Inc.
- John Baird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using molding pot having configured bottom
- Patent number 5,139,728
- Issue date Aug 18, 1992
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding pot having configured bottom
- Patent number 5,123,826
- Issue date Jun 23, 1992
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for encapsulating a semiconductor device
- Patent number 5,118,271
- Issue date Jun 2, 1992
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resilient mold assembly
- Patent number 5,059,105
- Issue date Oct 22, 1991
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding handling aid
- Patent number 5,040,965
- Issue date Aug 20, 1991
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding process for encapsulating semiconductor devices using a thi...
- Patent number 4,996,170
- Issue date Feb 26, 1991
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Internally molded isolated package
- Patent number 4,910,581
- Issue date Mar 20, 1990
- Motorola, Inc.
- John Baird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold press force equalizer
- Patent number 4,753,160
- Issue date Jun 28, 1988
- Motorola Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Self-cleaning mold
- Patent number 4,741,507
- Issue date May 3, 1988
- Motorola Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulation means and method for reducing flash
- Patent number 4,615,857
- Issue date Oct 7, 1986
- Motorola, Inc.
- John Baird
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Person

Patents Grantslast 30 patents

Low-profile ball-grid array semiconductor package and method

Thermoplastic interconnect for electronic device and method for making

Low-profile ball-grid array semiconductor package

Plastic encapsulated microelectronic device and method

Plastic encapsulated microelectronic device

Semiconductor package capable of spreading heat

Plastic encapsulated microelectronic device and method

Semiconductor package

Method of using molding pot having configured bottom

Molding pot having configured bottom

Apparatus for encapsulating a semiconductor device

Resilient mold assembly

Molding handling aid

Molding process for encapsulating semiconductor devices using a thi...

Internally molded isolated package

Mold press force equalizer

Self-cleaning mold

Encapsulation means and method for reducing flash