John Briar

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip molded/exposed die process and package structure
- Patent number 7,081,668
- Issue date Jul 25, 2006
- St Assembly Test Services Pte.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced BGA grounded heatsink
- Patent number 6,828,671
- Issue date Dec 7, 2004
- ST Assembly Test Services PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disposable mold runner gate for substrate based electronic packages
- Patent number 6,770,962
- Issue date Aug 3, 2004
- St Assembly Test Services Ltd.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,759,752
- Issue date Jul 6, 2004
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a package with an exposed die backside with an...
- Patent number 6,750,082
- Issue date Jun 15, 2004
- Advanpack Solutions PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip molded/exposed die process and package structure
- Patent number 6,660,565
- Issue date Dec 9, 2003
- ST Assembly Test Services PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded stiffener for flexible circuit molding
- Patent number 6,617,525
- Issue date Sep 9, 2003
- ST Assembly Test Services Ltd.
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,544,812
- Issue date Apr 8, 2003
- ST Assembly Test Service Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanarity inspection at the singulation process
- Patent number 6,543,127
- Issue date Apr 8, 2003
- ST Assembly Test Service Ltd.
- Antonio B. Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced BGA grounded heatsink
- Patent number 6,537,857
- Issue date Mar 25, 2003
- ST Assembly Test Service Ltd.
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip thermally enhanced ball grid array
- Patent number 6,479,903
- Issue date Nov 12, 2002
- ST Assembly Test Services Ltd.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming drop-in heat spreader plastic ball grid array (P...
- Patent number 6,432,742
- Issue date Aug 13, 2002
- ST Assembly Test Services PTE LTD
- Chow Seng Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disposable mold runner gate for substrate based electronic packages
- Patent number 6,372,553
- Issue date Apr 16, 2002
- ST Assembly Test Services, PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding flexible circuit with molded stiffener
- Patent number 6,355,199
- Issue date Mar 12, 2002
- ST Assembly Test Services PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip thermally enhanced ball grid array
- Patent number 6,255,143
- Issue date Jul 3, 2001
- ST Assembly Test Services PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming extended lead package
- Patent number 6,168,975
- Issue date Jan 2, 2001
- ST Assembly Test Services PTE LTD
- Tong Long Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded tape support for a molded circuit package prior to dicing
- Patent number 6,103,550
- Issue date Aug 15, 2000
- ST Assembly Test Services, Pte Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip chip molded/exposed die process and package structure
- Publication number 20040084688
- Publication date May 6, 2004
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for constraining the spread of solder during reflow for prep...
- Publication number 20040084508
- Publication date May 6, 2004
- Advanpack Solutions Pte. Ltd.
- John Briar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of assembling a package with an exposed die backside with an...
- Publication number 20040053445
- Publication date Mar 18, 2004
- Advanpack Solutions Pte. Ltd.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single unit automated assembly of flex enhanced ball grid array pac...
- Publication number 20030151148
- Publication date Aug 14, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced BGA grounded heatsink
- Publication number 20030085462
- Publication date May 8, 2003
- ST Assembly Test Services, Ltd.
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced BGA grounded heatsink
- Publication number 20020163064
- Publication date Nov 7, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Disposable mold runner gate for substrate based electronic packages
- Publication number 20020056893
- Publication date May 16, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded stiffener for flexible circuit molding
- Publication number 20020056570
- Publication date May 16, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Flip chip thermally enhanced ball grid array
- Publication number 20010026955
- Publication date Oct 4, 2001
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended lead package
- Publication number 20010002320
- Publication date May 31, 2001
- ST ASSEMBLY TEST SERVICES PTE LTD
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Flip chip molded/exposed die process and package structure

Enhanced BGA grounded heatsink

Disposable mold runner gate for substrate based electronic packages

Single unit automated assembly of flex enhanced ball grid array pac...

Method of assembling a package with an exposed die backside with an...

Flip chip molded/exposed die process and package structure

Molded stiffener for flexible circuit molding

Single unit automated assembly of flex enhanced ball grid array pac...

Coplanarity inspection at the singulation process

Enhanced BGA grounded heatsink

Flip chip thermally enhanced ball grid array

Methods of forming drop-in heat spreader plastic ball grid array (P...

Disposable mold runner gate for substrate based electronic packages

Method of molding flexible circuit with molded stiffener

Flip chip thermally enhanced ball grid array

Method of forming extended lead package

Molded tape support for a molded circuit package prior to dicing

Patents Applicationslast 30 patents

Flip chip molded/exposed die process and package structure

Method for constraining the spread of solder during reflow for prep...

Method of assembling a package with an exposed die backside with an...

Single unit automated assembly of flex enhanced ball grid array pac...

Enhanced BGA grounded heatsink

Enhanced BGA grounded heatsink

Disposable mold runner gate for substrate based electronic packages

Molded stiffener for flexible circuit molding

Flip chip thermally enhanced ball grid array

Extended lead package