John Bultitude

Person

Simpsonville, SC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 12,040,135
- Issue date Jul 16, 2024
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant multilayer ceramic capacitors
- Patent number 11,621,126
- Issue date Apr 4, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic overvoltage protection device having low capacitance and im...
- Patent number 11,393,635
- Issue date Jul 19, 2022
- KEMET Electronics Corporation
- Iain D. Kinnon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic overvoltage protection device having low capacitance and im...
- Patent number 11,393,636
- Issue date Jul 19, 2022
- KEMET Electronics Corporation
- Iain D. Kinnon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stack
- Patent number 11,227,719
- Issue date Jan 18, 2022
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic overvoltage protection device having low capacitance and im...
- Patent number 11,178,800
- Issue date Nov 16, 2021
- KEMET Electronics Corporation
- Lonnie G. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD suppression using light emissions
- Patent number 11,081,882
- Issue date Aug 3, 2021
- KEMET Electronics Corporation
- John Bultitude
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Gate drive interposer with integrated passives for wide band gap se...
- Patent number 11,037,871
- Issue date Jun 15, 2021
- KEMET Electronics Corporation
- Allen Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,984,955
- Issue date Apr 20, 2021
- KEMET Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages for power modules with integrated passives
- Patent number 10,950,688
- Issue date Mar 16, 2021
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered ceramic capacitor structures for use at high power
- Patent number 10,840,023
- Issue date Nov 17, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leadless stack comprising multiple components
- Patent number 10,790,094
- Issue date Sep 29, 2020
- KEMET Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,757,811
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stability structure
- Patent number 10,729,051
- Issue date Jul 28, 2020
- KEMET Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,707,145
- Issue date Jul 7, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,622,157
- Issue date Apr 14, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,593,483
- Issue date Mar 17, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,410,794
- Issue date Sep 10, 2019
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless stack comprising multiple components
- Patent number 10,381,162
- Issue date Aug 13, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,366,836
- Issue date Jul 30, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bulk MLCC capacitor module
- Patent number 10,224,149
- Issue date Mar 5, 2019
- Kemet Electronics Corporation
- Galen W. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,178,770
- Issue date Jan 8, 2019
- Kemet Electronics Corporation
- James A Burk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer ceramic capacitor structures for use at high power
- Patent number 10,147,544
- Issue date Dec 4, 2018
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stacks
- Patent number 10,068,707
- Issue date Sep 4, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component termination and assembly by means of transient...
- Patent number 9,881,744
- Issue date Jan 30, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MONOLITHIC MULTILAYERED CERAMIC CAPACITOR
- Publication number 20250022661
- Publication date Jan 16, 2025
- Kemet Electronics Corporation
- Miles T. Ingram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonant Multilayer Ceramic Capacitors
- Publication number 20230187134
- Publication date Jun 15, 2023
- KEMET Electronics Corporation
- John Bultitude
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Stable Power Modules By Thermoelectric Cooling
- Publication number 20230038175
- Publication date Feb 9, 2023
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonant Multilayer Ceramic Capacitors
- Publication number 20220076892
- Publication date Mar 10, 2022
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Terminal MLCC for Improved Heat Dissipation
- Publication number 20210327646
- Publication date Oct 21, 2021
- Kemet Electronics Corporation
- Mark R. Laps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structural Lead Frame
- Publication number 20210241977
- Publication date Aug 5, 2021
- Kemet Electronics Corporation
- Galen W. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Assemblies and Embedding for High Density Electronics
- Publication number 20210227693
- Publication date Jul 22, 2021
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stability Structure
- Publication number 20200323112
- Publication date Oct 8, 2020
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Power Modules with Integrated Passives
- Publication number 20200273949
- Publication date Aug 27, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Drive Interposer with Integrated Passives for Wide Band Gap Se...
- Publication number 20200273791
- Publication date Aug 27, 2020
- Kemet Electronics Corporation
- Allen Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Overvoltage Protection Device Having Low Capacitance and Im...
- Publication number 20200260618
- Publication date Aug 13, 2020
- Kemet Electronics Corporation
- Lonnie G. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Overvoltage Protection Device Having Low Capacitance and Im...
- Publication number 20200219657
- Publication date Jul 9, 2020
- KEMET Electronics Corporation
- Iain D. Kinnon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Overvoltage Protection Device Having Low Capacitance and Im...
- Publication number 20200161058
- Publication date May 21, 2020
- Kemet Electronics Corporation
- Iain D. Kinnon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Overvoltage Protection Device Having Low Capacitance and Im...
- Publication number 20200163260
- Publication date May 21, 2020
- KEMET Electronics Corporation
- Lonnie G. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD Suppression Using Light Emissions
- Publication number 20200028356
- Publication date Jan 23, 2020
- Kemet Electronics Corporation
- John Bultitude
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multilayer Ceramic Structure
- Publication number 20190355523
- Publication date Nov 21, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20190318877
- Publication date Oct 17, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Electronic Component Structures with Reduced Microphonic Noise
- Publication number 20190304698
- Publication date Oct 3, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Higher Density Multi-Component and Serial Packages
- Publication number 20190200457
- Publication date Jun 27, 2019
- Kemet Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Ceramic Structure
- Publication number 20190157009
- Publication date May 23, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190090348
- Publication date Mar 21, 2019
- Kemet Electronics Corporation
- John Bultitude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190080982
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190082539
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered Ceramic Capacitor Structures for Use at High Power
- Publication number 20190066927
- Publication date Feb 28, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Power Capacitors by Thermoelectric Cooling
- Publication number 20180368293
- Publication date Dec 20, 2018
- Kemet Electronics Corporation
- JOHN BULTITUDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Ceramic Capacitor Structures for Use at High Power
- Publication number 20180337002
- Publication date Nov 22, 2018
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Multi-Layered Ceramic Capacitor Stack
- Publication number 20180190430
- Publication date Jul 5, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Ceramic Structure
- Publication number 20180012706
- Publication date Jan 11, 2018
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stability Structure
- Publication number 20170367228
- Publication date Dec 21, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20170358397
- Publication date Dec 14, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS

John Bultitude

Person

Patents Grantslast 30 patents

Resonant multilayer ceramic capacitors

Structural lead frame

Component assemblies and embedding for high density electronics

Resonant multilayer ceramic capacitors

Method of forming an electronic device

Ceramic overvoltage protection device having low capacitance and im...

Ceramic overvoltage protection device having low capacitance and im...

Leadless multi-layered ceramic capacitor stack

Ceramic overvoltage protection device having low capacitance and im...

ESD suppression using light emissions

Gate drive interposer with integrated passives for wide band gap se...

Electronic component structures with reduced microphonic noise

Packages for power modules with integrated passives

Multilayered ceramic capacitor structures for use at high power

Method of forming a leadless stack comprising multiple components

High density multi-component packages

Higher density multi-component and serial packages

Component stability structure

High density multi-component packages

High density multi-component packages

Multilayer ceramic structure

Multilayer ceramic structure

Multilayer ceramic structure

Leadless stack comprising multiple components

Electronic component structures with reduced microphonic noise

Bulk MLCC capacitor module

Higher density multi-component and serial packages

Multilayer ceramic capacitor structures for use at high power

Leadless multi-layered ceramic capacitor stacks

Electronic component termination and assembly by means of transient...

Patents Applicationslast 30 patents

MONOLITHIC MULTILAYERED CERAMIC CAPACITOR

Resonant Multilayer Ceramic Capacitors

Stable Power Modules By Thermoelectric Cooling

Resonant Multilayer Ceramic Capacitors

Multi-Terminal MLCC for Improved Heat Dissipation

Structural Lead Frame

Component Assemblies and Embedding for High Density Electronics

Component Stability Structure

Packages for Power Modules with Integrated Passives

Gate Drive Interposer with Integrated Passives for Wide Band Gap Se...

Ceramic Overvoltage Protection Device Having Low Capacitance and Im...

Ceramic Overvoltage Protection Device Having Low Capacitance and Im...

Ceramic Overvoltage Protection Device Having Low Capacitance and Im...

Ceramic Overvoltage Protection Device Having Low Capacitance and Im...

ESD Suppression Using Light Emissions

Multilayer Ceramic Structure

Leadless Stack Comprising Multiple Components

Electronic Component Structures with Reduced Microphonic Noise

Higher Density Multi-Component and Serial Packages

Multilayer Ceramic Structure

High Density Multi-Component Packages

High Density Multi-Component Packages

High Density Multi-Component Packages

Multilayered Ceramic Capacitor Structures for Use at High Power

Stable Power Capacitors by Thermoelectric Cooling

Multilayer Ceramic Capacitor Structures for Use at High Power

Leadless Multi-Layered Ceramic Capacitor Stack

Multilayer Ceramic Structure

Component Stability Structure

Leadless Stack Comprising Multiple Components