John C. Conner

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device mounting with folded substrate and interp...
- Patent number 7,818,878
- Issue date Oct 26, 2010
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for trace shielding and routing on a substrate
- Patent number 7,375,978
- Issue date May 20, 2008
- Intel Corporation
- John Conner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded substrate with interposer package for integrated circuit dev...
- Patent number 7,358,444
- Issue date Apr 15, 2008
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEV...
- Publication number 20080148559
- Publication date Jun 26, 2008
- Robert M. NICKERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Folded substrate with interposer package for integrated circuit dev...
- Publication number 20060077644
- Publication date Apr 13, 2006
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for trace shielding and routing on a substrate
- Publication number 20050133255
- Publication date Jun 23, 2005
- Intel Corporation (a Delaware corporation)
- John Conner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR