John C. EHMKE

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Longview, TX, US

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Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR BONDED WAFER BARRIER
- Publication number 20240282716
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
- Publication number 20230238234
- Publication date Jul 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Andrew NELSON
- H01 - BASIC ELECTRIC ELEMENTS